A kind of manufacturing process of soft and hard combination board

Abstract

The invention discloses a manufacturing process of a soft-rigid combination board, comprising: a soft board layer process, including a step of laminating a cover film, and the cover film needs to leave an opening in the cover opening area; a bonding sheet process, including The step of punching out the opening in the cover-opening area; the hard board layer substrate processing process, including the step of punching out the opening in the cover-opening area; Layer substrates are arranged in order and pressed together; the hard board processing process includes the steps of printing peelable glue and peeling peelable glue. The present invention has the following significant beneficial effects: (1) It solves the problem of good protection of the soft board and no damage to the hard board in the hard board manufacturing process; (2) The peelable glue of this application is covered and opened by printing The cover area is convenient and efficient to operate; (3) The printing peelable glue step of this application is placed after the vertical glue removal step, which can prevent the peelable glue from falling off easily caused by the pressing plate step and the vertical glue removal step.

Description

technical field [0001] The invention relates to a manufacturing process of a rigid-flex board. Background technique [0002] With the continuous development and progress of PCB technology, printed circuit boards are gradually developing in the direction of light weight, thin thickness, small volume and high circuit density. Rigid-flex board saves a lot of space in the assembly of circuit boards through the organic combination of soft boards and hard boards. The demand for soft and hard boards from various end customers continues to increase. The production process and process of traditional rigid-flex boards that need to be opened are as follows: [0003] 1. FPC process of soft board: drilling -> circuit -> cover film -> primary lamination [0004] 2. Pure glue B / S process for PCB: pure glue punches out the opening -> one-time lamination [0005] 3. Core process: Punch out openings on the substrate -> one-time lamination [0006] 4. Hard board process: so...

AI Technical Summary

Problems solved by technology

[0007] This production process has the following problems: For products with surface treatment on flexible boards, this process does not provide protection actions, and cannot prevent the wet process potion of hard boards from attacking the gold surface or copper surface of flexible boards

However, because the exposed area of ​​the flexible board is generally very small, the requirements for lamination accuracy are relatively high, and the film needs to be applied manually, which requires more personnel.

In addition, due to the poor viscosity of the PI protective film, the pasted film often detaches halfway; if the viscosity is increased, it will cause the problem of sticking glue on the gold surface

There are also manufacturers who want to open the cover after use without changing the stacking structure, and then open it after making the green paint. However, because the B / S pure glue overflow is not easy to control, it is combined with the Core board beyond the soft and hard junction line, resulting in After opening the cover, the residual core is serious and the quality problems of soft and hard crossover lines are uneven.