Simultaneous monitoring device for femtosecond laser micromachining

Abstract

A simultaneous monitoring device for femtosecond laser micromachining comprises a femtosecond laser, wherein two parallel holophotes, an attenuation piece, a polarizing film, a beam splitter prism, two diaphragms, a shutter, a focusing lens and a machining object are sequentially arranged along a femtosecond laser light path outputted by the femtosecond laser. The machining object is fixed on a rotating translation device, and the centers of the diaphragms and the vertical central line of the machining object are on the same plane. An L-type support is further fixed on the rotating translation device, and the L-type support is provided with a CCD for monitoring. The rotating translation device, the CCD and the L-type support are all connected with a computer through signal lines. The beam splitter prism divides femtosecond laser into two light beams having completely same energy, one light beam is used for machining along the femtosecond laser light path, and the other light beam enters a power meter along the other light path to measure the energy of the femtosecond laser. Real-time simultaneous monitoring for changes generated on the surface of the machining object is achieved, and errors caused by multimetering are reduced. The two diaphragms are the same in height and collinear, and the light beams are kept fixed.

Description

technical field [0001] The invention relates to femtosecond laser micromachining technology, more specifically, to a femtosecond laser micromachining synchronous monitoring device and a femtosecond laser optical path. Background technique [0002] Femtosecond laser processing technology can break through the limitation of processing accuracy due to the diffraction limit in optical micromachining methods, and has the ability to directly process real three-dimensional microstructures inside transparent materials. It is a precision technology that can achieve no heat affected zone. laser processing technology. Femtosecond laser processing has the following advantages: (1) The heat effect on the surrounding processing area is small; (2) It can process other materials that are difficult to process with lasers, such as transparent materials, high melting point materials, thermal decomposers and thermally deformable materials, etc.; ( 3) Femtosecond laser micromachining technology...

AI Technical Summary

Problems solved by technology

[0003] At present, in femtosecond laser micromachining technology, the periodic structure induced during the interaction between laser and matter requires a small range of laser energy parameters to be able to form, and most of the micromachining is performed vertically. For microstructures induced under different angles and processing methods are immature

In this process, if we use the traditional method to conduct experiments, we will find that every time the laser interacts with the surface of the material, we cannot directly observe the changes on the surface of the material, so we cannot judge the impact of the experimental data on the material. Therefore, it is necessary to observe the material through other observation devices, so that the laser dot experiment requires a large number of repeated experiments, and repeated repeated observations will make the experiment very cumbersome.

At the same time, the position of each sample placement cannot be guaranteed to be at the same position, which will make the focus unable to accurately act on the surface of the processed object, which will further cause greater errors or even errors in the experimental results.

In addition, the traditional processing device cannot guarantee the consistency and repeatability of processing under different incident angles, which greatly increases the error and complexity of processing

Therefore, with the improvement of device precision and repeatability requirements, the existing technology can no longer meet the new requirements

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