Encapsulating piece for preventing chip salient point from being short-circuited and manufacturing process thereof

Abstract

The invention discloses an encapsulating piece for preventing a chip salient point from being short-circuited and a manufacturing process thereof. The encapsulating piece mainly comprises a copper circuit, an annular copper column, a copper column, a copper plate, a chip salient point, a chip, a molten chip salient point, a plastic package body, a copper column left after back side etching, a green oil layer and a tin ball, wherein the copper circuit, the annular copper column and the copper column are arranged on the copper plate; the molten chip salient point is bonded in the annular copper column; the chip is arranged at the chip salient point; the left copper column is formed after back side etching of the copper plate; the green oil layer is formed on the back side of the copper plate; the tin ball is arranged on the copper column left after back side etching; the plastic package body surrounds the upper surface of the copper plate, the copper circuit, the annular copper column, the copper column and the chip to form an integral circuit; and the chip, the chip salient point on the chip, the annular copper column and the copper column left after back side etching construct a power supply and a signal channel. The process flow comprises wafer thinning, wafer scribing, reserve chip loading, reflow cleaning, plastic package, etching for separating pins, filling green paint, printing and reballing of a steel screen, printing, cutting, packing and delivering. Due to the adoption of the encapsulating piece, short circuit between two chip salient points can be prevented, and the reliability of a product is improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing electronic information automation components, in particular to a package for preventing chip bumps from short-circuiting and a manufacturing process thereof. Background technique [0002] Flip Chip is not only a chip interconnection technology, but also an ideal chip bonding technology. As early as 30 years ago, IBM has developed and used this technology. But until recent years, Flip-Chip has become a frequently used packaging form in the field of high-end devices and high-density packaging. Today, the application range of Flip-Chip packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified, so the requirements for Flip-Chip packaging technology are also increasing. At the same time, Flip-Chip also poses a series of new serious challenges to manufacturers, providing reliable support for packaging, assembly and testing for this complex technology...

AI Technical Summary

Problems solved by technology

However, due to the limitations of traditional packaging in the past, the chip bumps melted and collapsed during the reflow process, causing a short circuit between the two chip bumps due to tin connection, and the height between the chip and the frame will also be reduced due to the collapse. Insufficient is likely to cause voids and affect product reliability

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