Method of the encapsulation vertical surface-mount module and base sheet, horse and vertical surface-mount module

Abstract

The invention discloses a method and base chip, feet rack, vertical sticking module of the encapsulated vertical sticking module. Said method includes: a weld plate which is corresponding with a input or output is inserted into said feet rack, and the weld plate of the base chip is aligned to feet; the weld plate of the base chip and feet are welded together; after the welding, the connection bar is eliminated to realize the separation of feet, every feet is corresponding with one input/output of said base chip; at last, assimilating cap is mounted. Under the condition of changeless size of module with this method, the number of I/O of feet of said module is increased to improve the circuit integration degree effectively.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a method for packaging a vertical surface mount module, a substrate, a lead frame, and a vertical surface mount module. Background technique [0002] A module is an integrated component that contains a variety of devices and is designed according to the principle of optimizing the circuit and system structure. In a broad sense, module technology can be understood as a technology that integrates different component packages on an independent unit. It is actually a small Printed Circuit Board Assembly (PCBA), which itself needs to be assembled and then reassembled. According to the form of secondary packaging of the module, it can be divided into vertical type and horizontal type. The module adopting vertical surface mount can effectively use the three-dimensional space of the single board. [0003] At present, the vertical surface-mount modules are all single-row, that is, ...

AI Technical Summary

Problems solved by technology

However, the package form of the vertical single surface mount module can be used to export the I / O port with a small number of pins. If the I / O number of the circuit is to be increased, the size of the substrate must be increased, thereby increasing the footprint and limiting However, the use of multiple single-row vertical surface-mount modules requires a large amount of printed circuit board (Printed Circuit Board, PCB) layout / wiring space, which affects the increase in PCB density and the miniaturization of products.

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