FCQFN packaging part filled by underfill material and production process thereof

Abstract

The invention discloses an FCQFN packaging part filled by an underfill material and a production process thereof. The packaging part is mainly composed of a bare copper frame, right side copper grooves, blocking convex blocks, inner pin convex blocks, inner pin nickel-palladium-aurum, an underfill material, a chip, tin-silver bumps, outer pin convex blocks, a plastic packaging material and solder balls, wherein the bare copper frame comprises the blocking convex blocks, the inner pin convex blocks and the outer pin convex blocks, the blocking convex block and the inner pin convex block are provided with the right side copper groove therebetween, and the inner pin convex blocks are plated by the inner pin nickel-palladium-aurum and bonded with the tin-silver bumps on the chip through the inner pin nickel-palladium-aurum; the underfill material surrounds the inner pin convex blocks, the tin-silver bumps of the chip and the lower surface of the chip; the reverse side of the inner pin convex block is the outer pin convex blocks, the outer pin convex blocks are provided with the solder balls, the bare copper frame is provided with reverse side copper grooves, the reverse side copper grooves are arranged at two sides of the outer pin convex blocks, and the plastic packaging material is filled in the reverse side copper grooves; and the chip, the tin-silver bumps, the inner pin nickel-palladium-aurum, the inner pin convex blocks, the outer pin convex blocks and the solder balls form a power supply and signal channel. The FCQFN packaging part filled by underfill material and the production process thereof simplify the technological process and improve the production efficiency.

Description

technical field [0001] The invention relates to the technical field of manufacturing electronic information automation components, in particular to an underfill-filled FCQFN package and a manufacturing process thereof. [0002] Background technique [0003] Flip Chip is not only a chip interconnection technology, but also an ideal chip bonding technology. IBM has developed and used this technology as early as 30 years ago. But until recent years, Flip-Chip has become a frequently used packaging form in the field of high-end devices and high-density packaging. Today, the application range of Flip-Chip packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified, so the requirements for Flip-Chip packaging technology are also increasing. At the same time, Flip-Chip also poses a series of new serious challenges to manufacturers, and it is necessary to provide reliable support for packaging, assembly and testing for this complex tech...

AI Technical Summary

Problems solved by technology

[0004] However, in the traditional process, the tin-silver bumps of the chip will melt and collapse during the reflow process, and the tin-silver bumps of the two chips will cause a short circuit due to the tin connection.

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