Method for interconnecting and packaging 3-D multi-chip module

Abstract

The invention discloses a 3D multichip module (MCM) interconnecting and packaging method, adopting ceramic bushing stacked transition wiring substrate to interconnect and package MCM stacked module, reducing system bulk and weight by various high density assembly to adapt to the development requirements of weapon equipment for miniaturization, high performance, multifunction, high reliability and low cost of electronic systems, converting the electronic packaging concept from device orientation into system orientation, thus increasing operational rate, assembling efficiency and heat radiating ability on the premise of assuring reliability and besides, increasing I / O number, reducing size and weight and cost. And the technical indexes of computer miniaturization by the method: operating frequency 25Mhz; connecting point number per unit area >or=104 / dm2; thermal resistance <0.45DEG C / W; I / O number 256; underfilling distance 30mm; and assembling efficiency 121%.

Description

technical field [0001] The invention belongs to the technical field of microelectronics and relates to the structural design of three-dimensional packaging, vertical interconnection, production of bumps and stacking reinforcement technology, specifically, a method for interconnection and packaging of three-dimensional multi-chip modules. Background technique [0002] Three-dimensional multi-chip module (3D-MCM) can effectively reduce the interconnection distance, interconnection resistance, interconnection capacitance and inductance of IC chips due to the use of vertical interconnection technology, which can reduce the transmission delay of signals by more than 300%. The assembly efficiency reaches more than 200%, which can further realize smaller volume and more functions, and has been developed rapidly at home and abroad. The structure of three-dimensional MCM is various. In terms of packaging structure, it can be divided into three categories: one is embedded 3D-MCM; the ...

AI Technical Summary

Problems solved by technology

[0005] 1) The interconnection line between the MCM laminated module and the shell is long, the signal delay is obvious, and the reliability is low

[0006] 2) The manufacturing process of bumps is complicated, the cost is high, and the detection of solder joints is difficult

[0008] 4) The chip is vulnerable to stress damage

[0009] 5) Three-dimensional packaging has large volume and low mechanical strength

With this electrical interconnection method, the substrate size is relatively small, the thermal resistance is large, the assembly is difficult, and a special case needs to be developed

[0011] For a 2D laminated module with dimensions of 60mm×60mm×8mm ( figure 1 , figure 2 ), if the lead wire is directly used for interconnection, the length of the interconnection wire is very large (about 12mm), the signal delay time is long, and the reliability is low

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