X-ray detector and manufacturing method thereof
A detector and X-ray technology, applied in the field of semiconductor devices and their manufacturing, can solve problems such as alignment accuracy error tolerance, interconnection bonding quality, etc.
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[0021] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various drawings, for the sake of clarity, various parts in the drawings are not drawn to scale.
[0022] In the following, many specific details of the present invention are described, such as device structures, materials, dimensions, processing techniques and techniques, for a clearer understanding of the present invention. However, the invention may be practiced without these specific details, as will be understood by those skilled in the art. Unless otherwise specified below, various parts in the semiconductor device may be composed of materials known to those skilled in the art.
[0023] In the present application, the term "semiconductor structure" refers to a semiconductor substrate formed after undergoing various steps of manufacturing a semiconductor device and all layers or regions that have been formed on the semiconductor substrate.
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