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Preparation method of heat-resisting seal microcapsule with sensitive pressure

A technology of microcapsules and microcapsule wall materials, which is applied in the field of heat-resistant microcapsule preparation, can solve the problems of complex production equipment, poor sealing of wall materials, and low mechanical strength, and achieve the effect of simple equipment

Active Publication Date: 2013-09-11
JURONG NINGWU SCI & TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the amine curing agent of epoxy resin has amphiphilicity and high activity, and it is very difficult to microencapsulate
In the past, people mostly used physical methods for microencapsulation, so the sealing performance of the wall material was poor, the mechanical strength was low, and the production equipment was complicated

Method used

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  • Preparation method of heat-resisting seal microcapsule with sensitive pressure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A preparation method of pressure-sensitive heat-resistant sealed microcapsules, the method is a dropping method, the steps are as follows:

[0021] 50g of epoxy resin E-51 and 2.5g of ethylenediamine, pre-polymerized at 50°C for 10min, then dissolved in 500ml of carbon tetrachloride, then 25g of ethylenediamine was added dropwise into the solution with a needle and kept at 50°C, The microcapsule wall is solidified and formed, filtered, washed and dried to obtain microcapsules.

Embodiment 2

[0023] Another preparation method of pressure-sensitive heat-resistant sealed microcapsules is a drop-adding method, and the steps are as follows:

[0024] 40g of epoxy resin E-44, 10g of styrene oxide SO and 3.0g of triethylenetetramine, pre-polymerized at 50°C for 8min, then dissolved in 500ml of DBP, and then 22.5g of tetraethylenepentamine was added dropwise to the solution with a needle Keep at 50°C in the middle, filter, wash and dry to obtain microcapsules after the microcapsule walls solidify and form.

Embodiment 3

[0026] 50g of epoxy resin E-51 and 4.5g of CAPCURE WR-6, pre-polymerized at 20°C for 12min, then dissolved in 500ml of xylene, then dripped CAPCURE WR-6, 32g into the solution with a needle and kept at 20°C, until The microcapsule wall is solidified and formed, filtered, washed and dried to obtain microcapsules.

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Abstract

The invention discloses a preparation method of a heat-resisting seal microcapsule with sensitive pressure. The preparation method comprises the steps of: firstly, preparing a microcapsule wall material, controlling the temperature to be within 20-80 DEG C, preparing epoxy rein and a core material curing agent equivalent to 0.50-0.85 time that of the epoxy resin into a prepolymer; then dissolving a prepolymer wall material in a solvent to form a solution; controlling the temperature of the solution to be within 20-80 DEG C, dropping a core material in the solution by using a needle hole until the microcapsule wall is cured and formed; filtering, washing and drying to obtain the heat-resisting seal microcapsule with the sensitive pressure. The preparation method is simple in process and equipment; meanwhile, a water phase is not introduced and the limitation to the water solubility or oil solubility of the microcapsule core material is not caused; through controlling the proportion and a system degree of functionality between the epoxy resin and the curing agent, the mechanical strength, the sealing property and the heat resistance of the microcapsule can be effectively controlled. The microcapsule is used as a micro-container, and can be used in fields of self-repairing materials, latent adhesives or other core materials needing release control or isolation.

Description

technical field [0001] The invention relates to a preparation method of microcapsules, in particular to a preparation method of heat-resistant microcapsules which are sensitive to external pressure and have excellent sealing performance. Background technique [0002] Thermosetting epoxy resin composites have excellent performance and are widely used. However, its curing process is often subject to various environmental conditions, and there are often contradictions between the pot life and the performance of the cured product, and the contradiction between the curing conditions and the performance of the cured product. Therefore, many latent curing agents have been developed to solve the contradiction between the pot life and the performance of the cured product to a certain extent. However, the contradiction between the curing conditions and the performance of the cured product is still very prominent. For example, in many construction or civil engineering, epoxy resin of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/02
Inventor 亢阳应珏应军朱建设翟洪金
Owner JURONG NINGWU SCI & TECH DEV
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