Thick-film anti-vulcanization paster resistor and manufacturing method thereof
A technology for chip resistors and manufacturing methods, applied in resistor manufacturing, resistors, resistor components and other directions, can solve the problems of excessive cost, high cost, different expansion coefficients, etc., to improve anti-sulfurization performance and reduce production costs , the effect of prolonging the vulcanization path
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Embodiment 1
[0066] Such as Figure 15 and 16 As shown, a thick-film anti-sulfurization chip resistor includes a square insulating substrate. Based on the direction of use, the lower surfaces of both ends of the insulating substrate are respectively covered with a layer of back electrodes 32; the upper surfaces of both ends of the insulating substrate are respectively covered with a layer of The first front electrode 22, the upper surface of the insulating substrate between the two first front electrodes is covered with a layer of resistance layer 23, the two first front electrodes are covered with a layer of second front electrode 24, and then covered on the resistance layer in turn The first protective layer 25 and the second protective layer 28; both ends of the resistance layer respectively extend to cover a part of the first front electrode; the second front electrode extends to cover a part of the resistance layer and a part of the first protective layer; the second The protective l...
Embodiment 2
[0073] Such as Figure 17 As shown, this embodiment includes all the technical features in Embodiment 1, the difference is that a third front electrode 27 is additionally provided, the third front electrode is located between the second front electrode and the nickel plating, and the third front electrode extends Select one to cover a part of the resistive layer and a part of the first protection layer.
[0074] By adding the third front electrode on the second front electrode, an overlapping and staggered structure of the first front electrode and the resistance layer, the second front electrode, the third front electrode and the first protection layer is formed. The specific overlapping and staggered structure can be as follows: the resistance layer extends and extends to cover a part of the first front electrode, then the second front electrode extends to cover a part of the resistance layer, the first protective layer extends to cover a part of the second front electrode, ...
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