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Resin composition

A technology of resin composition and compound, applied in the direction of adhesive types, adhesive additives, ester copolymer adhesives, etc. sexual difficulties

Inactive Publication Date: 2013-05-08
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is very difficult to impart UV curability to thiol-based adhesives
This is due to the following reasons: the reaction of UV-curable acrylic resin and thiol resin is easier than the reaction of resins other than acrylic resin (such as epoxy resin) and thiol resin. The shelf life of the agent will be shortened to a level where it is practically unusable

Method used

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Examples

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Embodiment

[0059] Hereinafter, examples of the present invention will be described, but the present invention is not limited to these.

[0060] (Preparation of resin composition)

[0061] Each component was mixed in the compounding shown in Table 1, 2, and the resin composition in Examples 1-21 was prepared.

[0062] Each component was mixed in the compounding shown in Table 3, and the resin composition in Comparative Examples 1-2 was prepared.

[0063] In addition, in Tables 1-3, all the figures which show the compounding ratio of each component of (A)-(G) are shown by weight part.

[0064] In Tables 1-3, the specific substance name etc. of each component of (A)-(G) are as follows. In addition, some structural formulas of (A) to (G) are shown in the following [Chemical 1], [Chemical 2], [Chemical 3], [Chemical 4].

[0065] (A1) Acrylic resin 1: "EBECRYL810" manufactured by DAICEL-CYTEC Company, Ltd.

[0066] Polyester acrylate, weight average molecular weight about 1000, 4 functional ...

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Abstract

Provided is a light- and heat-curable resin composition that has a sufficiently long pot life. The resin composition contains (A) an acrylic resin, (B) a thiol compound, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization suppressor. The resin composition preferably further contains (F) a radical polymerization initiator. The resin composition preferably also contains (G) a compound other than an acrylic resin having at least two double bonds.

Description

technical field [0001] The present invention relates to a resin composition cured by light and heat. More specifically, it relates to a photo- and thermosetting resin composition that can be temporarily fixed by light irradiation and can be completely cured by heating. Background technique [0002] Adhesives of the type that are temporarily fixed by ultraviolet (UV) irradiation and completely cured by heat are used in various fields (for example, refer to Patent Documents 1 and 2), and are often used especially in image sensor module applications. use. Image sensors are weak at high temperatures, so low-temperature curability is required for adhesives. On the other hand, from the viewpoint of production cost, the adhesive also requires short-term curability. Examples of low-temperature, short-time curing adhesives include thiol-based adhesives (for example, refer to Patent Documents 3 and 4). However, it is very difficult to impart UV curability to thiol-based adhesives....

Claims

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Application Information

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IPC IPC(8): C08G75/04C08G59/02C09J11/06C09J109/00C09J133/00C09J147/00C09K3/10H01L23/29H01L23/31C08G75/045C08K5/55C08L9/00C08L81/02C09J181/00
CPCC09J133/00C09J109/00C08G75/04C09K2200/0625C08G59/02C09K3/10C09J147/00C08L9/00C09J11/06C08K5/36C09J2433/00C08G75/045C08L33/04C08K5/37C09J133/04H01L23/29H01L23/31C08G75/14
Inventor 岩谷一希
Owner NAMICS CORPORATION
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