Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Screening method of chips for tiny satellite

A screening method and micro-satellite technology, applied in the field of micro-satellites, can solve problems such as the inability to guarantee the application of chips, and achieve the effect of avoiding repeated tests and reducing the detection process

Active Publication Date: 2013-05-08
NAT UNIV OF DEFENSE TECH
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a screening method for COTS chips used in small satellites, so as to solve the technical problem that the screening methods in the prior art cannot guarantee the application of chips in the aerospace field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Screening method of chips for tiny satellite
  • Screening method of chips for tiny satellite

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] (1) Select the same batch of COST components (n=100), and randomly check 10% of them (n=10) for destructive tests: firstly, conduct radiation testing, and place COST components at a dose rate of 2rad / s After being placed in the radiation for 1.5 hours, it was taken out, and there were 8 COST components that were detected to be operating normally; the 8 COST components that were operating normally were scanned under ultrasonic waves at a frequency of 1 to 10MHz, and inspected with a 100X microscope, and 8 COST components All components are qualified; 8 qualified COST components are subjected to visual inspection, X-ray inspection, internal visual inspection after cap opening, bonding strength, passivation layer integrity inspection, SEM inspection, package profile inspection, and 8 COST components All devices comply with the contents of MIL-STD-883G2009, MIL-STD-883G2012, MIL-STD-883G2030, GJB548A2011A, GJB548A2019A standards.

[0054] (2) Place the remaining 90 COST com...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a screening method of chips for a tiny satellite. The screening method comprises the following steps: selecting the chips of the same batch for a destructive test which is used for evaluating chip technology and material performance so as to obtain test-result-qualified chips, the destructive test is used for having a reliability screening to the test-result-qualified chips in the destructive test in order to obtain chips which are capable of being used for the tiny satellite, and the reliability screening is used for evaluating service lives of the chips. The screening method of the chips for the tiny satellite solves the technical problem that the screening methods in the prior art can not ensure that checkout test set (COTS) chips are applied to the field of aerospace.

Description

technical field [0001] The invention relates to the field of microsatellites, in particular to a method for screening chips for microsatellites. Background technique [0002] Due to the radiation impact of the space radiation environment, traditional satellite electronic systems mostly use aerospace-grade chips processed by special processes. Due to the small size, light weight, and low cost of microsatellites, these characteristics determine that microsatellites cannot use a large number of aerospace-grade chips like large satellites, but need to use low-cost chips, such as civilian COTS components (Commercial Off- The-Shelf) and components, adopt methods such as screening, reinforcement and redundant backup to enhance the reliability of the micro-satellite system and ensure the long-term reliable operation of the micro-satellite. [0003] The screening test of the chip refers to the test for selecting products with certain characteristics or eliminating early failure prod...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R31/308
Inventor 张育林宋新陈利虎绳涛赵勇程云
Owner NAT UNIV OF DEFENSE TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products