Micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method

Abstract

The invention relates to a micro-electromechanical system (MEMS) silicon wafer scribing and cutting and structure releasing method which comprises the following steps of: attaching an ultraviolet (UV) film to the back of an MEMS silicon wafer; setting a first scribing thickness of the silicon wafer or the height of a scribing cutter, wherein the first scribing thickness is 40-55 percent of that of the silicon wafer; setting a second scribing thickness to be thickness of residual silicon (full scribing) of the silicon wafer or setting the height of the scribing cutter to be a sum of the thickness of the residual silicon to be finally retained and the thickness of the UV film (semi scribing); after scribing is finished, eliminating 80-90 percent of the viscosity of the UV film; picking up a chip on the UV film or taking down the whole silicon wafer and putting the silicon wafer into a tray with filtration holes; putting the tray into a degummin solution for degumming; eliminating liquid and dehydrating; and releasing the structure. By a twice scribing technology, the problems that the edge of the thick chip is hopped, pollution is caused by silicon slag, and inner stress on the chip is large because of scribing are solved; and meanwhile, by the designed special tray, the sequence contradiction of MEMS silicon wafer scribing and structure releasing is avoided.

Description

technical field [0001] The invention relates to a MEMS silicon wafer dicing cutting and structure releasing method, which belongs to micro-processing of micro-electromechanical systems and wafer dicing and cutting methods. Background technique [0002] Micro-electromechanical systems (MEMS, Micro-electromechanical Systems) is a high-tech field based on microelectronics technology and micro-processing technology. MEMS technology can integrate mechanical components, drive components, electronic control systems, digital processing systems, etc. into an integral micro-unit. MEMS devices have many advantages such as tiny, intelligent, executable, integrable, good process compatibility, and low cost. The development of MEMS technology has opened up a new technical field and industry. Micro sensors, micro actuators, micro components, micro mechanical optical devices, vacuum microelectronic devices, power electronic devices, etc. made by MEMS technology are widely used in aviation,...

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a MEMS silicon wafer dicing cutting and structure release method, which overcomes the edge jumping and silicon chip contamination that the scribing process in the prior art is easy to produce for thicker large chips, Scribing leads to the defect problem of large internal stress in the chip; in addition, because the chip of the wafer has a MEMS structure, there are contradictory defects in the order of scribing and structure release.

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