A wafer-level through-silicon transmission structure applicable to microwave frequency bands and its manufacturing method
A technology of microwave frequency band and transmission structure, applied in semiconductor/solid-state device manufacturing, waveguide, waveguide-type devices, etc., can solve the problems of lithography capability and lithography precision limitation, coaxial line difficulties, etc., and achieve small mechanical and physical damage , Guaranteed precision and simple process steps
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[0027] exist Figure 2-1-Figure 2-10 In , the process flow of the wafer-level through-silicon transmission structure applied in the microwave frequency band is introduced in detail.
[0028] 1. Surface pretreatment of silicon wafer 101, growth of oxide layer 102, such as diagram 2-1 shown.
[0029] a) performing surface pretreatment on both sides of the silicon wafer 101;
[0030] b) growing an oxide layer 102 as a mask.
[0031] 2. Form the through hole etching window 103, such as Figure 2-2 shown.
[0032] a) Forming a through-hole etching window 103 on the front surface of the silicon wafer 101 by photolithography, development and etching.
[0033] 3. Form blind holes (holes that are not pierced) 104, such as Figure 2-3 shown.
[0034] a) Form a vertical silicon blind hole 104 with a depth of half the thickness of the silicon wafer (for example, about 225 μm) on the front surface of the silicon wafer 101 by deep reactive ion etching (DRIE) process.
[0035] 4. Fo...
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