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Inorganic/organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same

An organic hybridization and nano-composite technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of inability to balance high refractive index adhesion and mechanical properties, low refractive index, affecting material light transmission and mechanical properties, etc. question

Active Publication Date: 2013-04-24
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For the former method, although it is easy to achieve a high refractive index of the system, there are also insurmountable shortcomings. For example, when the particle size of inorganic nanoparticles is too large or the amount is too large, it will seriously affect the light transmission performance and mechanical properties of the material. performance
For the latter method, on the one hand, because the refractive index of organic groups is lower than that of inorganic nanoparticles and the range of variation is narrow, the degree of improving the refractive index of materials is not high; on the other hand, organic materials have low surface hardness and heat resistance. Poor performance, it is often difficult to achieve the comprehensive performance of the system
Therefore, one of the methods alone cannot take into account the high refractive index, excellent adhesion and mechanical properties of the material, etc.

Method used

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  • Inorganic/organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same
  • Inorganic/organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same
  • Inorganic/organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] (1) Preparation of nano-oxide sol: Dissolve 5.0 g of anhydrous zinc acetate in 50 mL of absolute ethanol, and stir evenly with electromagnetic. Mix 0.5g of sodium hydroxide, 2.0g of deionized water and 20mL of absolute ethanol evenly, and add dropwise to the ethanol solution of zinc acetate, and react at 20°C for 3 hours to obtain a zinc oxide sol with an average particle size of 10nm.

[0055] (2) Preparation of epoxy phenyl oligosiloxane: 10g of epoxy alkyl silane OC 6 h 9 CH 2 CH 2 Si(OCH 3 ) 3 , 100g phenylsilane (C 6 h 5 ) 2 Si(OCH 2 CH 3 ) 2 , 30g alkane-based silane (CH 3 ) 2 Si(OCH 3 ) 2 , 10g of deionized water, 1g of catalyst dibutyltin dilaurate and 80g of 1,4-dioxane were placed in a three-necked flask, stirred evenly, and reacted at 80°C for 6h. After the reaction, the reaction solution was decompressed at 70°C Rotary evaporation for 1 h to remove water, solvent and by-products to obtain colorless and transparent epoxy phenyl oligosiloxane. ...

Embodiment 2

[0059] (1) Preparation of nano-oxide sol: Dissolve 13.5g of titanium isopropoxide and 16.5g of zirconium butoxide in 120mL of isopropanol, and mix evenly with electromagnetic stirring. Mix 3.0g propionic acid, 1.0g deionized water and 100mL isopropanol evenly, and add dropwise to the isopropanol solution of titanium isopropoxide and zirconium butoxide, react at 80°C for 4 hours, and the average particle size is 72nm titania-zirconia sol.

[0060] (2) Preparation of epoxy phenyl oligosiloxane: 30g of epoxy alkyl silane OC 6 h 9 CH 2 CH 2 Si(OCH 3 ) 3 , 100g phenylsilane (C 6 h 5 ) 2 Si(OCH 3 ) 2 , 10g alkane-based silane (CH 3 CH 2 CH 2 CH 2 ) 2 Si(OCH 3 ) 2, 20g of deionized water, 1.8g of catalyst dibutyltin diacetate and 100g of tetrahydrofuran were placed in a three-necked flask, stirred evenly, and reacted at 70°C for 16h. After the reaction, the reaction solution was rotated at 50°C for 2h to remove water , solvents and by-products to obtain colorless an...

Embodiment 3

[0064] (1) Preparation of nano-oxide sol: Dissolve 50g of zirconium butoxide in 300mL of butanol, and mix evenly with electromagnetic stirring. Mix 10g of acetic acid, 100g of deionized water and 50mL of butanol evenly, add dropwise to the zirconium butoxide solution, and react at 60°C for 8h to obtain a zirconia sol with an average particle size of 25nm.

[0065] (2) Preparation of epoxy phenyl oligosiloxane: OCH 20g of epoxy alkyl silane 2 CHCH 2 OC 3 h 6 SiPh(OCH 2 CH 3 ) 2 , 100g phenylsilane CH 3 (C 6 h 5 )Si(OCH 3 ) 2 , 20g alkane silane CH 3 Si(OC 2 h 5 ) 3 , 1g of deionized water, 5.0g of catalyst stannous octoate and 400g of ethylene glycol dimethyl ether were placed in a three-necked flask, stirred evenly, and reacted at 100°C for 24h. After the reaction, the reaction solution was rotated at 100°C for 0.5 h remove water, solvent and by-products to obtain colorless and transparent epoxy phenyl oligosiloxane.

[0066] (3) Preparation of inorganic / organi...

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Abstract

The invention belongs to the field of optical semiconductor device packaging materials, and discloses inorganic / organic hybridization nanometer composite resin and light-emitting diode (LED) packaging materials prepared by the same. The inorganic / organic hybridization nanometer composite resin is prepared by epoxy group phenyl group oligomerization siloxane and inorganic nanometer materials in a composite and hybridization mode. The LED packaging materials are prepared by raw materials of the inorganic / organic hybridization nanometer composite resin. The preparation steps comprise that 100 parts by weight of the inorganic / organic hybridization nanometer composite resin, 0.1-40 parts by weight of curing agents, 0-1.0 part by weight of curing accelerator, 0-2.0 parts by weight of light scattering agents and 0-2.0 parts of antioxidants are mixed uniformly, procured for 1-3 hours at the temperature of 60-90 DEG C, then cured for 2-4 hours at the temperature of 120-140 DEG C, and finally cured for 2-6 hours at the temperature of 160-180 DEG C, and the LED packaging materials are obtained.

Description

technical field [0001] The invention belongs to the field of packaging materials for optical semiconductor devices, and in particular relates to an inorganic / organic hybrid nanocomposite resin containing inorganic nano oxides, organic phenyl functional groups and epoxy functional groups and an LED packaging material prepared therefrom. technical background [0002] Light-emitting diode (LED) is the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-pressure gas lamps. It is one of the most promising high-tech fields in the 21st century. In the widely used LED lighting devices at present, the packaging material is an indispensable part. It not only has the functions of sealing and protecting the chip, heat dissipation and transmitting signals, but also protects the LED device from the ambient temperature and humidity. The effect of reducing the refractive index difference between the chip and the air to effectively improve the light output ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08K3/22C08K3/36C08G77/14H01L33/56
Inventor 刘伟区高南
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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