Method for preparing electromagnetic energy harvester using micro-nano processing technology
An energy harvester and micro-nano processing technology, applied in the direction of microstructure technology, technology for producing decorative surface effects, decorative art, etc., can solve the problems of unfavorable large-scale production and processing, low efficiency, limited output voltage, etc.
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Embodiment 1
[0053] refer to figure 1 , figure 1 For the step flowchart of the energy harvester that the present invention adopts, comprise the steps:
[0054] Step S1, using double-sided oxidation on a clean (100) crystalline silicon wafer silicon oxide
[0055] Step S2, sputtering metal on a clean (100) silicon wafer by sputtering Metal
[0056] Step S3, drop the photoresist on the surface of the silicon wafer, first pre-level the glue at a speed of 540r / s for 60s, and then perform the formal coating of 1500r / s for 180s to ensure that the photoresist is evenly spread on the surface of the silicon wafer. Dry the film at 100°C for 300s. Expose for 125s under the photolithography machine, then take it out. Then develop and soak in the developer for 30s. Ensure visualization under a microscope. The film was baked at 100°C for 600s.
[0057] Step S4, setting up the electroplating device, adjusting the electroplating current so that the current density is 1ASD, connecting the sili...
Embodiment 2
[0068] refer to figure 1 , figure 1 For the step flowchart of the energy harvester that the present invention adopts, comprise the steps:
[0069] Step S1, using double-sided oxidation on a clean (100) crystalline silicon wafer silicon oxide
[0070] Step S2, sputtering metal on a clean (100) silicon wafer by sputtering Metal
[0071] Step S3, drop the photoresist on the surface of the silicon wafer, first pre-level the glue at a speed of 540r / s for 60s, and then perform the formal coating of 1500r / s for 180s to ensure that the photoresist is evenly spread on the surface of the silicon wafer. Dry the film at 100°C for 300s. Expose for 125s under the photolithography machine, then take it out. Then develop and soak in the developer for 30s. Ensure visualization under a microscope. The film was baked at 100°C for 600s.
[0072] Step S4, setting up the electroplating device, adjusting the electroplating current so that the current density is 1ASD, connecting the sili...
Embodiment 3
[0083] refer to figure 1 , figure 1 For the step flowchart of the energy harvester that the present invention adopts, comprise the steps:
[0084] Step S1, using double-sided oxidation on a clean (100) crystalline silicon wafer silicon oxide
[0085] Step S2, sputtering metal on a clean (100) silicon wafer by sputtering Metal
[0086] Step S3, drop the photoresist on the surface of the silicon wafer, first pre-level the glue at a speed of 540r / s for 60s, and then perform the formal coating of 1500r / s for 180s to ensure that the photoresist is evenly spread on the surface of the silicon wafer. Dry the film at 100°C for 300s. Expose for 125s under the photolithography machine, then take it out. Then develop and soak in the developer for 30s. Ensure visualization under a microscope. The film was baked at 100°C for 600s.
[0087] Step S4, setting up the electroplating device, adjusting the electroplating current so that the current density is 1ASD, connecting the sili...
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