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Low-temperature halogen-free lead-free solder paste

A halogen-free lead-free solder paste and solder paste technology, applied in the field of surface mount technology low-temperature lead-free process welding, can solve the problems of poor mechanical properties and mechanical strength of solder paste, and achieve superior solubility, less residue, and guaranteed welding. performance effect

Inactive Publication Date: 2013-03-27
郴州金箭焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the solder paste has a low melting point and improved wettability and reliability, the mechanical properties and mechanical strength of the solder paste are poor

Method used

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  • Low-temperature halogen-free lead-free solder paste
  • Low-temperature halogen-free lead-free solder paste
  • Low-temperature halogen-free lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Preparation method: mix 20g ethylene glycol dibutyl ether, 20g pentaerythritol, 5g propylene glycol monophenyl ether, 30g hydrogenated rosin, 10g pentaerythritol rosin, 2g succinic acid, 2g lauric acid, 1g adipic acid and 3g stearic acid Heating to 120°C + 5°C until completely dissolved; while stirring, add 5g of modified hydrogenated castor oil and 2g of benzothiazole in sequence, and continue stirring to room temperature after dissolving. Take 10g of flux and 90g of solder powder and mix and stir under vacuum conditions to obtain a uniformly mixed low-temperature halogen-free lead-free solder paste.

Embodiment 2

[0036] Preparation method: 15g ethylene glycol dibutyl ether, 20g pentaerythritol, 5g propylene glycol monophenyl ether, 9g 2-methyl-hexanediol, 25g hydrogenated rosin, 10g terpene rosin, 5g succinic acid, 2g adipic acid, Mix 2g of stearic acid evenly and heat to 130°C + 5°C until completely dissolved; add 4g of modified hydrogenated castor oil and 3g of benzothiazole sequentially under stirring, and continue stirring to room temperature after dissolving. Take 12g of flux and 88g of solder powder and mix and stir under vacuum conditions to obtain a uniformly mixed low-temperature halogen-free lead-free solder paste.

Embodiment 3

[0038] Preparation method: 15g ethylene glycol dibutyl ether, 15g pentaerythritol, 11g propylene glycol monophenyl ether, 5g 2-methyl-hexanediol, 28g modified rosin, 10g pentaerythritol rosin, 3g succinic acid, 2g lauric acid, 2g Mix adipic acid and 2g stearic acid evenly and heat to 130°C + 5°C until completely dissolved; while stirring, add 5g of modified hydrogenated castor oil and 2g of benzothiazole in sequence, and continue stirring to room temperature after dissolving. 11g of flux and 89g of solder powder were mixed and stirred under vacuum conditions to obtain a uniformly mixed low-temperature halogen-free lead-free solder paste.

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PUM

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Abstract

The invention relates to a low-temperature halogen-free lead-free solder paste. The solder paste is mixed by Sn-Ag-Bi-based lead-free solder powder added with P or rare earth elements and a rosin-based soldering flux. The soldering flux is basically composed of, by weight, 30-45% of rosin resin, 2-10% of an organic acid activator, 3-5% of a thixotropic agent, 2-5% of a corrosion inhibitor, 3-5% of a surfactant and the balance solvents. The solder paste has the advantages that the welding temperature is low, slag is reduced, and the solder paste is suitable for manual welding and printing welding with poor thermal shock resistance.

Description

technical field [0001] The invention relates to a solder paste, in particular to a low-temperature halogen-free lead-free solder paste. It is mainly used in through-hole plug-in lead-free reflow process soldering, and is also suitable for low-temperature lead-free process soldering in surface mount technology. Background technique [0002] With the development of soldering technology, following the trend of miniaturization and functionalization of electronic components, more and more soldering methods such as reflow soldering, wave soldering, dip soldering or spray soldering are available for electronic manufacturers to choose. The soldering of surface mount components adopts reflow soldering method; through-hole plug-in components can be soldered by wave soldering, dip soldering or spray soldering according to the situation. Among them, wave soldering is more suitable for the soldering of through-hole components on the whole board; dip soldering is more suitable for the we...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/40
Inventor 胡洁
Owner 郴州金箭焊料有限公司
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