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Small paster type quartz crystal resonator and processing method thereof

A quartz crystal and chip-type technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as frequency drift, easy cracking of the chip, use, etc., to improve vibration resistance and frequency stability, improve mechanical and electrical performance, The effect of reducing manufacturing costs

Inactive Publication Date: 2013-03-13
CHENGDU KINGBRI FREQUENCY TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current chip-type quartz resonator uses conductive glue to bond the quartz wafer plated with electrodes and the spring piece of the base together, and adds an insulating gasket at the bottom to make it, which has the following defects: the base uses a spring piece; the product It is difficult to achieve a height below 2.0mm
In addition, due to the size of the wafer, the length of the product is limited to more than 6mm, and the width is limited to more than 3mm
Due to the long size of the chip, the impact resistance of the product is weak, and the chip is easy to break when the product is impacted
Moreover, the spring sheet is easily deformed when it is impacted or vibrated, causing frequency drift; the material increases and the cost increases

Method used

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  • Small paster type quartz crystal resonator and processing method thereof
  • Small paster type quartz crystal resonator and processing method thereof
  • Small paster type quartz crystal resonator and processing method thereof

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] like Figure 1-2 As shown, the small patch type quartz crystal resonator disclosed by the present invention includes a shell 1, a quartz wafer 2 coated with electrodes, a conductive glue 3, a base 5, a glass bead 6, a lead wire 7, an insulating gasket 8, and a lead wire 7 The top of the top is provided with a plug 4 connected to the quartz wafer 2 through a conductive glue 3, there are two lead wires 7, the wheelbase of the two lead wires 7 is 2.3 mm or less, the thickness of the base 5 is 0.5 mm or less, and the quartz wafer 1 It is bar-shaped, with a size of 2.3×1.6mm or less.

[0031] Preferably, the diameter of the lead wire 7 is 0.35 mm or less, and the diameter of the plug 4 is 0.6 mm or less.

[0032] like Figure 3-5 As shown, further, the surfac...

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Abstract

The invention discloses a small paster type quartz crystal resonator which comprises a casing, a quartz crystal wafer plated with an electrode, conductive glue, a base, glass balls, leads and an insulation gasket. A top head connected with the quartz crystal wafer through the conductive glue is arranged at the top of each lead, the axial distance of the two leads is 2.3mm or below 2.3mm, the thickness of the base is equal to or smaller than 0.5mm, the quartz wafer adopts a strip wafer, and the size of the quartz wafer is equal to 2.3*1.6mm or smaller than 2.3*1.6mm. A processing method of the small paster type quartz crystal resonator is further disclosed. The small paster type quartz crystal resonator is capable of meeting the requirement for miniature, improves mechanical performance and improves frequency stability.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a quartz crystal resonator and a processing method thereof. Background technique [0002] With the miniaturization of terminal electronic products, the miniaturization of the components used is required, and the miniaturization of quartz crystal resonators is also an inevitable trend of development. The current chip-type quartz resonator uses conductive glue to bond the quartz wafer plated with electrodes and the spring piece of the base together, and adds an insulating gasket at the bottom to make it, which has the following defects: the base uses a spring piece; the product It is difficult to achieve a height below 2.0mm. In addition, due to the size of the wafer, the length of the product is limited to more than 6mm, and the width is limited to more than 3mm. Due to the long size of the chip, the impact resistance of the product is weak, and the chip is easy to break whe...

Claims

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Application Information

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IPC IPC(8): H03H9/19H03H3/02
Inventor 刘青彦梁羽杉杨清明黄建友
Owner CHENGDU KINGBRI FREQUENCY TECH
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