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OLED packaging structure and packaging method thereof

A technology of packaging structure and packaging method, which is applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of sealing failure of packaging structure, cracking or peeling of packaging structure, limitation of glue width and glue height, etc. The effect of improving sealing, improving mechanical strength, and increasing the bonding area

Active Publication Date: 2015-04-08
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

This packaging method has good airtightness, but due to the influence of laser energy distribution, there are certain restrictions on the width and height of the glue.
In addition, during the laser melting process, the glass glue will generate stress due to heating. When the glass glue is melted and cooled to form a package structure fixed with the package cover and the substrate to be packaged, the residual stress inside the package structure will cause cracks in the package structure. or delamination, resulting in failure of the seal of the package structure

Method used

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  • OLED packaging structure and packaging method thereof
  • OLED packaging structure and packaging method thereof
  • OLED packaging structure and packaging method thereof

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Embodiment Construction

[0036] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0037] Please also see figure 1 and figure 2 , the present invention provides an OLED package structure, comprising a package cover 1, a substrate 2 opposite to the package cover 1, a substrate located between the package cover 1 and the substrate 2 and arranged on the substrate 2. The OLED device 21, the desiccant 12 located between the packaging cover 1 and the substrate 2 and provided on the periphery of the OLED device 21, the desiccant 12 provided on the periphery of the desiccant 12 to bond the packaging cover 1 and the substrate 2 The sealant 13 , and the frit glass 11 arranged on the periphery of the sealant 13 to bond the package cover 1 and the substrate 2 .

[0038] Further, such as figure 2 As shown, the OLED device 21 include...

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Abstract

The invention provides an OLED packaging structure and a packaging method thereof. The structure comprises a packaging cover plate (1), a substrate (2) which is opposite to the packaging cover plate (1) in arrangement, an OLED device (21) which is positioned between the packaging cover plate (1) and the substrate (2) and arranged on the substrate (2), a drying agent (12) which is positioned between the packaging cover plate (1) and the substrate (2) and arranged at the periphery of the OLED device (21), frame glue (13) which is arranged at the periphery of the drying agent (12) and adheres the packaging cover plate (1) and the substrate (2), and sintered glass (11) which is arranged at the periphery of frame glue (13) and adheres the packaging cover plate (1) and the substrate (2). Frame glue and sintered glass are adopted together for packaging by the structure so that sealing performance is great and mechanical strength is enhanced. Besides, the drying agent is arranged at the external side of the OLED device so as to be suitable for packaging of top emission and bottom emission type OLED devices simultaneously.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging structure and a packaging method thereof. Background technique [0002] OLED is an Organic Light-Emitting Diode (Organic Light-Emitting Diode), which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. It began to gradually replace traditional liquid crystal displays and was widely used in mobile phone screens, computer monitors, full-color TVs, etc. Unlike traditional liquid crystal display technology, OLED display technology does not require a backlight, and uses very thin coatings of organic materials and glass substrates that emit light when an electric current passes through them. However, because organic materials are easy to react with water vapor or oxygen, as a display device based on organic materials, OLED displays have very high requirements for packaging. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/8426H10K50/846H10K71/00
Inventor 曾维静吴泰必
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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