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Production method of epoxy resin electronic potting material

A technology of epoxy resin and production method, which is applied in the field of potting materials to achieve the effects of improving acid resistance, increasing chemical resistance and strength, and good insulation effect

Inactive Publication Date: 2013-03-13
南通市福来特化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing epoxy resin potting compound is difficult to meet the above requirements at the same time

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] A production method of epoxy resin electronic potting compound, comprising component A and component B, the weight ratio of component A per 1000kg is: methyltetrahydrophthalic anhydride: 900kg, modifier: 100kg; The weight ratio of B component per 1000kg is: epoxy resin: 900kg, modifier: 100kg; the production method of the epoxy resin electronic potting compound includes the following steps:

[0015] (1) Component A: Move methyltetrahydrophthalic anhydride into the reaction kettle, add an appropriate amount of modifier, stir and raise the temperature, the temperature is 120℃, and the pressure is 2kg / cm 2 , Keep for 2 hours to get A component;

[0016] (2) Component B: Move the epoxy resin into the reactor, add an appropriate amount of modifier, stir and raise the temperature, the temperature is 120℃, and the pressure is 2kg / cm 2 , Keep for 2 hours to get B component;

[0017] (3) Package A component and B component separately to make epoxy resin electronic potting compound.

[0...

Embodiment 2

[0021] A production method of epoxy resin electronic potting compound, comprising component A and component B, the weight ratio of component A per 1000kg is: methyltetrahydrophthalic anhydride: 950kg, modifier: 50kg; The weight ratio of B component per 1000kg is: epoxy resin: 930kg, modifier: 70kg; the production method of the epoxy resin electronic potting compound includes the following steps:

[0022] (1) Component A: Move methyltetrahydrophthalic anhydride into the reactor, add appropriate amount of modifier, stir and raise the temperature, the temperature is 140℃, and the pressure is 2kg / cm 2 , Keep for 3 hours, get A component;

[0023] (2) Component B: Move the epoxy resin into the reactor, add an appropriate amount of modifier, stir and raise the temperature, the temperature is 140℃, and the pressure is 2kg / cm 2 , Keep for 3 hours to get B component;

[0024] (3) Package A component and B component separately to make epoxy resin electronic potting compound.

[0025] The epoxy ...

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PUM

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Abstract

The invention relates to the technical field of potting materials, particularly a production method of an epoxy resin electronic potting material. The epoxy resin electronic potting material comprises a component A and a component B, wherein every 1000kg of the component A comprises the following components in parts by weight: 900-980kg of methyltetrahydrophthalic anhydride and 20-100kg of modifier; and every 1000kg of the component B comprises the following components in parts by weight: 900-950kg of epoxy resin and 50-100kg of modifier. When being used in various electronic components, the epoxy resin electronic potting material has the functions of fixation, moisture protection, corrosion protection, forgery prevention and the like, and has the characteristics of high temperature resistance, high voltage resistance, favorable insulation effect and the like. The adoption of the polyester resin, urea-formaldehyde melamine resin, furfural resin, vinyl resin, isocyanate or silicon resin modifier further enhances the acid resistance, heat resistance and shock strength of the epoxy resin potting material, and improves the chemical resistance and strength of the epoxy resin potting material.

Description

Technical field [0001] The invention relates to the technical field of potting materials, in particular to a production method of epoxy resin electronic potting materials. Background technique [0002] Epoxy resin has excellent dielectric properties, mechanical properties and adhesion properties, its curing shrinkage is small, the linear expansion coefficient is small, the dimensional stability is good, and the operation process performance is good, so it is widely used in various fields. [0003] With the continuous development of electronic technology, epoxy resin has become one of the important pillars of the electronics industry. Materials with epoxy resin as the main body are widely used in the bonding, potting, and packaging of electronic components, and the fixing of electronic components , Moisture-proof, anti-corrosion, and anti-counterfeiting have played an important role. However, due to the further development of electronic technology, its packaging requirements are ge...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08L67/00C08L61/30C08L61/00C08L23/06C08L83/00C08G59/42C08G18/58
Inventor 王悦康
Owner 南通市福来特化工有限公司
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