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Chemical nickel-phosphorus alloy plating solution

An electroless nickel-phosphorus plating and plating solution technology, applied in the field of metal surface treatment, can solve the problems of high production cost, slightly exceeding 20 μm/h, generally less than 20 μm/h, and less than 10 μm/h, and achieve good promotion and application Value, broaden the pH range, reduce the effect of plating temperature

Inactive Publication Date: 2013-03-06
LUDONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to relevant reports, in the acidic electroless nickel plating process, the nickel-phosphorus alloy can only be deposited at a minimum temperature above 50°C. h, some even less than 10μm / h, resulting in high production costs

Method used

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  • Chemical nickel-phosphorus alloy plating solution
  • Chemical nickel-phosphorus alloy plating solution
  • Chemical nickel-phosphorus alloy plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1: the influence of pH value on deposition rate

[0026] The technological formula is: nickel sulfate hexahydrate 40g / L, sodium hypophosphite dihydrate 40g / L, lactic acid 20ml / L, sodium acetate 15g / L, urea 10g / L; the temperature is 80-83°C.

[0027] When the pH value is 3, the deposition rate is 3.2 μm / h; when the pH value is 4, the deposition rate is 8.4 μm / h; when the pH value is 5, the deposition rate is 23.8 μm / h; when the pH value is 6, the deposition rate is 30.1 μm / h; It is 6.5, and the deposition rate is 22.3 μm / h.

[0028] The experimental results show that the reduction of sodium hypophosphite is enhanced with the increase of pH value, and the deposition rate of the alloy is accelerated; when the pH value is very low, the deposition rate is small; with the increase of pH value, the deposition rate is accelerated. When the pH value rises to 5.5-6, the deposition rate is the fastest; when the pH value is above 6, the deposition rate decreases with th...

Embodiment 2

[0029] Embodiment 2: the influence of temperature on deposition rate

[0030] The technological formula is: nickel sulfate hexahydrate 40g / L, sodium hypophosphite dihydrate 40g / L, lactic acid 20ml / L, sodium acetate 15g / L, urea 10g / L; pH value is 5.0-5.1.

[0031] The deposition rate at 30°C is 0.2 μm / h, the deposition rate at 40°C is 2.3 μm / h, the deposition rate at 50°C is 4.6 μm / h, the deposition rate at 60°C is 8.9 μm / h, the deposition rate at 70°C is 15.2 μm / h, and the deposition rate at 80°C is 23.2 μm / h, the deposition rate at 90°C is 31.2 μm / h; the deposition rate at 95°C is 35.2 μm / h.

[0032] Experimental results show that nickel-phosphorus alloy coatings can be obtained in the range of 30-95°C. In the range of 30-50 °C, the deposition rate increases slowly with the increase of temperature; at 50-80 °C, the deposition rate increases rapidly with the increase of temperature; after 80 °C, the increase of deposition rate slows down slightly with the increase of temperat...

Embodiment 3

[0033] Embodiment 3: the influence of urea on deposition temperature and deposition rate

[0034] The technological formula is: 40g / L of nickel sulfate hexahydrate, 40g / L of sodium hypophosphite dihydrate, 20ml / L of lactic acid, 15g / L of sodium acetate, and the pH value is 5.0-5.1.

[0035] (1) Effect of urea on deposition temperature

[0036] When urea is not added, the deposition rate is 0 μm / h at 30°C, 0 μm / h at 40°C, 0.5 μm / h at 50°C, 2.9 μm / h at 60°C, 10.2 μm / h at 70°C, and 10.2 μm / h at 80°C The deposition rate is 13.7 μm / h, the deposition rate at 90°C is 18.4 μm / h; the deposition rate at 95°C is 21.3 μm / h.

[0037] (2) Effect of urea on deposition rate

[0038] When the temperature is controlled at 80-83°C, the deposition rate of 1g / L urea is 18.2μm / h, the deposition rate of 5g / L urea is 21.5μm / h, the deposition rate of 10g / L urea is 23.1μm / h, 15g / L The deposition rate of urea is 24.7μm / h, and the deposition rate of 20g / L urea is 23.4μm / h.

[0039] The experimental r...

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Abstract

The invention relates to chemical nickel-phosphorus alloy plating solution. Each liter of plating solution comprises 20 to 45g of nickel sulfate hexahydrate, 20 to 45g of sodium hypophosphite dihydrate, 15 to 25ml of lactic acid, 10 to 15g of sodium acetate, 2 to 15g of urea and the balance of water. According to the invention, the urea is used as an additive; a coordination complex is formed by the urea and nickel ions; a deposition mechanism of a nickel-phosphorus alloy is changed, so that a deposition temperature is greatly reduced and a better coating can be obtained at lower temperature; the production cost is reduced; and the benefits are increased for enterprises.

Description

technical field [0001] The invention relates to an electroless nickel-phosphorus alloy plating solution, which belongs to the technical field of metal surface treatment. Background technique [0002] Due to its excellent coating performance and plating characteristics, electroless nickel plating has been widely used in aerospace, petrochemical, mechanical power, transportation, light industry electronics, household appliances and nuclear industries for more than 70 years. develop. However, in the current acidic electroless nickel plating process, there are generally problems such as slow plating speed, high plating temperature, poor stability of plating solution, and high production cost, which plague the development of this field. In order to solve these problems, various processes such as alkaline electroless nickel plating have appeared successively, but each has advantages and disadvantages. [0003] In the acidic electroless nickel plating process, the core technology...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
Inventor 张丕俭殷平陈文曲荣君陈厚徐强张江
Owner LUDONG UNIVERSITY
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