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Method for air-tightly welding shell and cover plate of microwave component

A microwave component and hermetic sealing technology, which is applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of circuit module failure, circuit performance reduction, and corrosion of circuit solder joints, so as to improve reliability and life, and improve Airtight qualified rate and the effect of reducing production cost

Inactive Publication Date: 2013-02-27
SHANGHAI SPACEFLIGHT INST OF TT&C & TELECOMM
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Due to the presence of a large amount of water vapor, salt spray, etc. in the air, if these particles enter the interior of the component, they will corrode the circuit solder joints, reduce the circuit performance, or cause the circuit module to fail

Method used

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  • Method for air-tightly welding shell and cover plate of microwave component
  • Method for air-tightly welding shell and cover plate of microwave component
  • Method for air-tightly welding shell and cover plate of microwave component

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Embodiment Construction

[0014] The technical solution adopted by the invention to solve its technical problems is to provide a sealed microwave component aluminum alloy shell. In the joint form of seal welding, the seal welding is carried out in a glove box filled with Ar, and a magnetic clamp is used during welding, and the magnetic base of the magnetic clamp and the pressing block attract each other.

[0015] The present invention will be further elaborated below in conjunction with the accompanying drawings and specific embodiments.

[0016] Such as figure 1 Shown is the structural composition of microwave components. Generally, the shell of microwave components is in the shape of a square box, which is composed of a shell, an internal microcircuit, a protective gas in the cavity and a cover plate, as well as glass beads for signal input and output, and for power supply. The supplied socket, the seal between these connectors and the housing is generally sealed by soldering before the microwave co...

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Abstract

The invention discloses a method for air-tightly welding a shell and a cover plate of a microwave component. Laser seal welding is adopted; a limited type overlapping structure is used as a joint form for air-tightly welding the shell and the cover plate of the microwave component; a magnetic fixture is adopted during performing seal welding in a glove box full of Ar; and a magnetic base of the magnetic fixture and a press block are attracted by each other. The method disclosed by the invention has the advantages of high air-tightness, small welding heat affected zone, flexible track, no contact in the machining process, environment friendliness and so on and is applied to airtight packaging process of the microwave component shells of various products; and laser seal welding with very high air-tightness is achieved.

Description

technical field [0001] The invention relates to the technical field of electronic equipment, in particular to a method for hermetically sealing a microwave assembly shell and a cover plate through laser welding. Background technique [0002] Microwave components are important electronic equipment components, so there are many restrictions on the process methods used in hermetic packaging: (1) The internal temperature of the cavity cannot exceed the maximum temperature that the chip or solder can withstand during sealing to avoid damage to the chip or soldering (2) There should be no volatilization of toxic gases during sealing, preferably in a protective atmosphere. After sealing, the environment inside the shell must be clean; (3) After sealing, the strength of the weld seam must be guaranteed, and at least it can withstand a negative pressure. internal force. [0003] Since the laser sealing and welding technology can not only meet the above basic conditions, but also has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/12B23K26/20B23K26/21
Inventor 任颖丹黄浩远王立春
Owner SHANGHAI SPACEFLIGHT INST OF TT&C & TELECOMM
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