Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Adsorption device for semiconductor refrigeration

A technology of semiconductor and refrigeration sheet, applied in the field of semiconductor refrigeration or heating, can solve the problems of increasing the difficulty of bonding, increasing the complexity of design, uncontrollability, etc., and achieves the effect of convenient air intake, not easy to lose, and reducing the difficulty of operation

Active Publication Date: 2013-01-30
HANGZHOU DIANZI UNIV
View PDF4 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to fit the two planes, some adhesives and other media are needed for fixing, which increases the complexity and uncontrollability of the design
If the fitting plane has a certain curvature, it will increase the difficulty of fitting

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Adsorption device for semiconductor refrigeration
  • Adsorption device for semiconductor refrigeration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Below, the present invention will be further described in conjunction with the accompanying drawings.

[0028] Semiconductor refrigeration or heating technology is reversible, and only the adsorption device of the present invention can be used for both refrigeration and heating. The refrigeration of the present invention will be described below.

[0029] Such as figure 1 As shown, an adsorption device for semiconductor refrigeration includes a refrigeration mechanism and a closed chamber to be cooled, specifically including a semiconductor refrigeration chip 1, an air cavity 2, a first sealing ring 3, a smooth flat plate 4, a cavity 5, a heat insulating layer 6, a sealing Plug 7, connecting wire 8, ring 9.

[0030] The refrigeration mechanism includes a semiconductor cooling chip 1, a first sealing ring 3, a sealing plug 7, a connecting wire 8, and a ring 9; the semiconductor cooling chip 1 has a mosaic structure, and the part of the first sealing ring 3 is embedded on...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an adsorption device for semiconductor refrigeration. The adsorption device comprises a refrigeration mechanism and a closed chamber to be cooled, wherein the refrigeration mechanism comprises a semiconductor refrigeration sheet, first sealing rings, a sealing plug, a connecting line and a circular ring; the semiconductor refrigeration sheet has a mosaic structure; part of each first sealing ring is embedded in the semiconductor refrigeration sheet; the circular ring is fixed on the side surface of the semiconductor refrigeration sheet by welding, and is connected with the sealing plug through the connecting line; a vent hole is formed in one of the first sealing rings, and the sealing plug is inserted in the vent hole and is closely matched with the first sealing ring; the closed chamber to be cooled comprises a smooth flat plate, a cavity and a heat insulating layer; and the cavity is surrounded by the heat insulating layer and the smooth flat plate together, and exchanges heat with the outside through the smooth flat plate. According to the adsorption device, the semiconductor refrigeration sheet does not need to be closely attached to a plane to be refrigerated, so that the operation difficulty of a attaching technique is reduced, air induction and air admission are convenient, and the adsorptive power is high in controllability.

Description

technical field [0001] The invention belongs to the field of semiconductor refrigeration or heating, and in particular relates to an adsorption device for semiconductor refrigeration. Background technique [0002] Traditional air-conditioning and refrigeration technologies include: vapor compression cycle and absorption refrigeration cycle. The vapor compression air-conditioning system has a high refrigeration coefficient and strong cooling and heating capabilities, but the refrigerant CFCs used in this system has more or less damage to the ozone layer, and it is very noisy during operation and has a large volume. Large, window air conditioners are especially noticeable. The COP value of the absorption air conditioning system is medium, and it has the advantages of waste heat reuse and regeneration heat, but the system volume is relatively large. The above technologies are all suitable for occasions with large power requirements and large space. Relatively speaking, semico...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02
Inventor 刘光宇邹洪波沈国强许辉李兵
Owner HANGZHOU DIANZI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com