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Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board

A technology of electroplating nickel and working fluid, which is applied in the field of electroplating nickel working fluid for FPC plates, can solve the problems of high scrap rate, copper foil falling off, difficulty in mass production, etc., and achieve the effect of improving yield rate

Active Publication Date: 2015-04-01
丰顺县达森科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the FPC with a PET substrate is used for electroplating nickel-gold surface treatment, the adhesive between the PET substrate and the copper substrate will be peeled off due to the hydrogen evolution reaction of the electroplating cathode, causing the copper foil to separate from the PET substrate. fall off
At present, the scrap rate of FPC sheets based on PET is very high when they are electroplated with nickel and gold, so it is difficult to carry out mass production
The present invention is developed to solve the problem that the copper foil falls off when the FPC plate of the PET base material is electroplated with nickel.

Method used

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  • Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
  • Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board
  • Electro-nickelling working solution for PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Select 2-pentylbenzimidazole sodium and sodium ferrocyanide to prepare nickel-plating working solution in a ratio of 1:2 by weight, and prepare nickel-plating working solution 1L with auxiliary softener, wetting agent, complexing agent and buffer , the specific dosage is shown in the table below.

[0021]

[0022] The electroplating nickel working solution prepared from the components in the above table treats the copper surface. The treatment process follows several steps such as degreasing→water washing→micro-etching→water washing→nickel plating→water washing→air drying→activation→gold plating. The nickel plating treatment temperature is 55 °C, and the treatment time was 5 minutes. Gold plating was performed after the treatment, and the PET base material and the copper surface did not peel off.

Embodiment 2

[0024] Select 2-pentylbenzimidazole sodium and sodium ferrocyanide to prepare nickel-plating working solution in a ratio of 1:1 by weight, and prepare nickel-plating working solution 1L with auxiliary softener, wetting agent, complexing agent and buffer , the specific dosage is shown in the table below.

[0025]

[0026]

[0027] The electroplating nickel working solution prepared from the components in the above table treats the copper surface. The treatment process follows several steps such as degreasing→water washing→micro-etching→water washing→nickel plating→water washing→air drying→activation→gold plating. The nickel plating treatment temperature is 55 °C, and the treatment time was 5 minutes. Gold plating was performed after the treatment, and the PET base material and the copper surface did not peel off.

Embodiment 3

[0029] Select 2-pentylbenzimidazole sodium and sodium ferrocyanide to prepare nickel-plating working solution in a ratio of 1:1 by weight, and prepare nickel-plating working solution 1L with auxiliary softener, wetting agent, complexing agent and buffer , the specific dosage is shown in the table below.

[0030]

[0031] The electroplating nickel working solution prepared from the components in the above table treats the copper surface. The treatment process follows several steps such as degreasing→water washing→micro-etching→water washing→nickel plating→water washing→air drying→activation→gold plating. The nickel plating treatment temperature is 55 °C, and the treatment time was 5 minutes. Gold plating was performed after the treatment, and the PET base material and the copper surface did not peel off.

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Abstract

The invention discloses an electro-nickelling working solution for a PET (polyethylene glycol terephthalate) substrate based FPC (flexible printed circuit) board; the electro-nickelling working solution comprises the following components in percentage by weight: 0.01-10% of anti-stripping agent, 0.1-50% of buffer agent boric acid, 0.1-50% of dissolving-assistant wetting agent, and the balance of purified water, wherein the anti-stripping agent is a mixture of sodium benzimidazole derivative and sodium ferrocyanide with a weight ratio of (0.5-2):1, the dissolving-assistant wetting agent is one or two selected from methanol, ethanol, isopropanol, acetone, N, N-dimethylformamide, glycol ether and ethylene glycol. The PET substrate based tough copper-clad plate processed according to the invention can effectively ensure that releasing and stripping are unlikely to occur between the PET substrate and the copper foil after a nickelling treatment. The yield of the PET substrate based FPC board electro-nickelling technique can be greatly improved, so that the electro-nickelling treatment to PET substrate based FPC boards for large quantities becomes possible.

Description

technical field [0001] The invention relates to a nickel electroplating working solution for FPC board material of a PET base material. Background technique [0002] In the electronics manufacturing industry, copper-clad laminates are widely used as substrates and circuit materials, and their surfaces often need anti-oxidation treatment to meet the requirements of subsequent welding or processing. There are many processes applied to the surface treatment of copper metal in industry, such as nickel-gold electroplating, OSP (organic solderability coating), tin spraying, chemical nickel-gold, immersion silver, etc. Among them, the nickel-gold electroplating process is the nickel-plating and gold-plating process after the circuit pattern processing and copper plating have been completed. This process can effectively protect the copper surface from the erosion of external corrosive or oxidizing atmosphere, achieve the effect of anti-oxidation, and at the same time have good sold...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/12C25D5/56
Inventor 朱虹张毅孙颖睿
Owner 丰顺县达森科技有限公司
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