Production process for O.J diode

Abstract

The invention relates to a production process for an O.J diode. The production process is characterized by comprising the following steps: coating photoresist on a silicon wafer after the silicon wafer is plated with nickel; carrying out photo-etching to form a pattern on the N+ surface of the silicon wafer; scribing with the pattern on the N+ surface of the silicon wafer as a reference scribing line; carrying out acid-corroding on the surface of the scribed chip; removing the photoresist from the surface and plating with nickel again; and then, welding, washing with alkali, slivering and carrying out other conventional procedures so as to fabricate the diode. The chip protected by the photoresist is corroded with acid, so that the damage generated on the chip during scribing can be eliminated; after the chip is corroded with acid, the photoresist is removed and the chip is welded, and then, the chip is washed with alkali, so that metal substances in welding materials and lead wires can be prevented from reacting with acid during acid-washing so as to affect the corrosion rate of the chip; and a large number of cleaning processes can be saved, so that resources are saved. In addition, as no metal ions are absorbed on the surface of the chip, faults such as electrical degradation, thermal breakdown at a high temperature and the like of the product can be avoided, and the electrical yield can be increased from the traditional 96% to 98%.

Description

technical field [0001] The invention relates to a diode production process, in particular to an O.J diode production process. Background technique [0002] The traditional PN junction bare diode (Open Junction, referred to as O.J chip) uses a chip (main component: silicon), solder (main component: lead, tin, silver) and leads (main component: copper) for high temperature welding, and then the chip surface pickling treatment. During the pickling process, the metal substances in the solder and the leads will react with the mixed acid, which will affect the corrosion rate of the chip. In addition, the metal ions (or atoms) generated by the reaction of these metals with acid will be attached to the surface of the chip in the form of chemical bonds, and the post-process needs to use a large amount of pure water and chemical reagents for cleaning. Such cleaning not only consumes a lot of resources, but also cannot thoroughly clean the copper atoms attached to the chip surface. ...

AI Technical Summary

Problems solved by technology

Such cleaning not only consumes a lot of resources, but also cannot completely clean the copper atoms attached to the surface of the chip.

Copper atoms are attached to the surface of the chip, which will lead to failures such as electrical degradation of the product and thermal breakdown at high temperatures. This is also the biggest quality "bottleneck" of O.J diodes

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