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Photohardening resin composition and application thereof

A resin composition and photocuring technology, applied in the field of photocurable resin compositions, can solve the problems of small volume shrinkage, outgassing quality, poor curing rate, etc., and achieve the effect of improving reliability

Active Publication Date: 2015-02-11
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The volume shrinkage rate of the resin composition is small, but the hardening rate is easy to be poor due to the process conditions, and the acrylate monomers are not fully reacted, resulting in poor quality such as outgassing and other easy to occur in subsequent use.

Method used

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  • Photohardening resin composition and application thereof
  • Photohardening resin composition and application thereof
  • Photohardening resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Preparation of photocurable resin composition

[0060] The photocurable resin composition of Example 1 includes (A) 100 parts by weight of olefin-containing oligomer UC203, (B) monomers containing at least one acrylate group including dicyclopentadienyl ethoxy acrylate 22.2 and 12.3 parts by weight of methyl triethylene glycol acrylate, (C) photoinitiator including 3.4 parts by weight of TPO and 6.8 parts by weight of I184, and (D) 196.6 parts by weight of softener polybutadiene. After mixing the above components uniformly, the photocurable resin composition is obtained.

[0061] hard programming

[0062] The photocurable resin composition was irradiated with a low-pressure mercury lamp contained in an exposure machine (purchased from USHIO Company, model USH-500BYI), wherein the ultraviolet light wavelength band was 365nm, and the exposure intensity was 30mW / cm 2 And the irradiation dose is 5000mJ / cm 2 , to cure the resin composition.

[0063] Curing ratio analysis...

Embodiment 2~4 and comparative example 1~2

[0075] The preparation method of the photocurable resin composition of Examples 2~4 and Comparative Examples 1~2 is the same as that of Example 1, the difference is that each Example and Comparative Example use different compounds containing at least one acrylate group monomer Kind, the chemicals used in Examples 2~4 and Comparative Examples 1~2 and consumption are recorded in Table 1.

[0076] The photocurable resin compositions of Examples 2-4 and Comparative Examples 1-2 were respectively subjected to curing rate analysis. The analysis and calculation methods were the same as those of Example 1, and the calculation results are listed in Table 1.

[0077] Table 1

[0078]

[0079]As shown in Table 1, the differences in the components of Examples 1-4 and Comparative Examples 1-2 mainly lie in the types of monomers containing at least one acrylate group. From the test results, it can be clearly known that Examples 1-4 can obtain a curing rate higher than 90% and a normal a...

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Abstract

A photohardening resin composition comprises (A) oligomer containing ethylenic bonds, (B) monomers containing at least one acrylate group, and (C) a photoinitiator, wherein (B) is selected from mono-acrylate monomers shown in formula (I), bis-acrylate monomers shown in formula (II) or a composition of the two, and the formula (I) and the formula (II) are defined in the specification and the claims. The invention also provides an adhesion layer formed by irradiation of the photohardening resin composition, a display element containing the adhesion layer, and a method for preparing the display element by using the photohardening resin composition. The hardening of the photohardening resin composition of the invention causes no gas release phenomenon, which further improves the reliability of the display element for subsequent application.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a photocurable resin composition. Background technique [0002] Optical clear resin is mainly used for bonding between optical components (such as touch panels, liquid crystal display panels, cover lenses, lenticular lenses, TFT-LCD modules, etc.); After the glue is hardened, it can be used as a spacer between components. Therefore, in addition to having adhesiveness, the optical glue must also meet the requirements of the properties (such as mechanical properties, optical properties, etc.) of subsequent products. [0003] Optical adhesives can be roughly classified into thermosetting resin compositions, light-curing resin compositions, and photothermo-curing resin compositions. Since some display elements, such as electroluminescent (EL) devices, have a heat-resistant temperature of about 80-120°C and poor heat resistance, they are not suitable for heating. Therefore, thermosettin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J7/00C09J5/00
Inventor 李信宏吴督宜谢育材
Owner DAXIN MATERIALS
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