Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micromechanical filter with fully sealed structure

A filter and micro-mechanical technology, which is applied in the field of micro-mechanical filters with a fully sealed structure, can solve the problems of being unable to achieve full sealing and reduce the volume of the filter, and achieve the goals of reducing volume, improving packaging efficiency, and reducing packaging volume Effect

Active Publication Date: 2014-10-15
CHINA ELECTRONICS TECH GRP NO 26 RES INST
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The problem to be solved by the present invention is to provide a micro-mechanical filter with a fully sealed structure and high reliability, which overcomes the shortcomings of existing micro-mechanical filters that cannot be fully sealed, and further reduces the volume of the filter. It has many advantages such as large bandwidth, small size, good amplitude and phase consistency, and mass production.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micromechanical filter with fully sealed structure
  • Micromechanical filter with fully sealed structure
  • Micromechanical filter with fully sealed structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The micromechanical filter with a fully sealed structure provided by the present invention, the filter includes an upper dielectric layer and a lower dielectric layer stacked up and down, interdigitated electrodes with tapped signal lines are arranged between the upper dielectric layer and the lower dielectric layer The middle metal electrode layer; the upper surface of the lower dielectric layer in contact with the middle metal electrode layer is provided with a first cavity matching the interdigitated electrode tap signal line; the lower dielectric layer in contact with the middle metal electrode layer A second cavity matching the interdigitated electrode fingers is provided on the surface; a metal layer on the upper surface of the upper dielectric layer is arranged above the surface of the upper dielectric layer, and a metal layer on the lower surface of the lower dielectric layer is arranged below the surface of the lower dielectric layer. The upper and lower dielect...

Embodiment 2

[0037] The fully sealed micromechanical filter will be further described as follows:

[0038] figure 1 It is a layered perspective diagram of a micro-mechanical filter with a fully-sealed structure. The micro-mechanical filter with a fully-sealed structure based on micro-mechanical technology is composed of two dielectric layers superimposed on top of each other. There is a micro-mechanical process between the two dielectric layers. The metal electrode layer made; wherein, f1 is the metal layer on the upper surface of the upper dielectric layer, f2 is the upper dielectric layer, f3 is the middle metal layer, f4 is the lower dielectric layer, f5 is the lower surface metal layer of the lower dielectric layer, and the upper dielectric layer is There are cavities prepared by etching process on the surface; there are through holes on the upper and lower dielectric layers, and a metal layer is prepared on the inner wall of the through holes; there are surface electrode layers made b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a micro mechanical filter of a full-sealing structure. A basic structure of the filter is of an interdigital stripline filter structure and formed by vertically overlapping two layers of dielectric materials, and an interdigital metal electrode layer manufactured by a micro mechanical process is arranged between the two layers of dielectric materials. A cavity manufactured by using an etching process is arranged on an upper surface of a lower dielectric, through holes are arranged on both an upper dielectric layer and the lower dielectric layer, and metal layers are manufactured on inner walls of the through holes. A surface electrode layer is manufactured by using the micro mechanical process on surfaces of both the upper dielectric layer and the lower dielectric layer, and an input lead-out line and an output lead-out line are arranged on a surface of one of the two dielectric layer. Compared with the existing micro mechanical filter, size is further reduced, a wafer level packaging method is used, a shortcoming that the existing micro mechanical filter cannot achieve full sealing is overcome, outer casing packaging is not needed, and assembly is simplified.

Description

technical field [0001] The invention relates to a fully-sealed micro-mechanical filter with wafer-level packaging, in particular to a filter based on micro-mechanical technology and made of high-resistance silicon or quartz materials. Background technique [0002] With the development of communication technology, the whole system puts forward requirements for microwave filters such as large bandwidth, small size, and high amplitude and phase consistency. Traditional microwave filter technologies such as cavity filters, microstrip filters, dielectric filters, low-temperature co-fired ceramic (LTCC) filters, and thin-film bulk acoustic wave filters are difficult to achieve in terms of bandwidth, volume, and amplitude-phase consistency. fulfil requirements. [0003] Micromechanical filter is a new type of device that combines microwave filter design and micromechanical process technology. It successfully applies MEMS technology to the design of microwave filter by using silico...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/203B81B7/00
Inventor 杜波马晋毅江洪敏曹家强杨靖蒋欣
Owner CHINA ELECTRONICS TECH GRP NO 26 RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products