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A fluorescent resin component and its manufacturing method

A technology of fluorescent resin and manufacturing method, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., which can solve the problems of fluorescent powder emission wavelength shift, poor scattering of blue light chips, and affecting the light efficiency of devices, so as to keep the light effect from degrading , Avoid the effect of device light efficiency drop and low ambient temperature

Active Publication Date: 2015-08-12
镇江瑞吉光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional packaging of white light LED devices is to mix silica gel or resin with phosphor powder and then directly coat the surface of the blue light chip. This packaging technology has its inherent disadvantages
Since the silica gel (or resin) and the phosphor powder are in direct contact with the blue light chip, the scattering of the blue light chip is not smooth when it is working, and the high operating temperature of the chip makes the emission wavelength of the phosphor powder shift and the luminous intensity decreases.
On the other hand, the phosphor powder is close to the surface of the blue light chip, so that part of the light emitted by the phosphor re-enters the chip and is absorbed, resulting in luminous loss and affecting the light efficiency of the device.

Method used

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  • A fluorescent resin component and its manufacturing method
  • A fluorescent resin component and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Example 1: by figure 1 A method for producing a phosphor-containing resin will be described in detail. The resin material is optical grade acrylic (PMMA VH001) with a particle size of 5 microns. The phosphor is YAG yellow phosphor with a particle size of 5 microns. The ultraviolet absorber is UV-327, and the antioxidant is antioxidant 1010.

[0035] The volume ratio of acrylic to phosphor is 100:15%; the mass ratio of acrylic to ultraviolet absorber UV-327 is 100:0.25; the mass ratio of acrylic to antioxidant 1010 is 100:0.25.

[0036] After fully mixing phosphor powder and acrylic powder, at 160 o C is molded into a plate with a thickness of 0.4 mm, and cooled to room temperature to obtain a fluorescent resin. The obtained fluorescent resin has a smooth surface without burrs.

[0037] Afterwards, the obtained fluorescent resin was again heated at 130 o The C-molded overmolding is a hollow cube with a wall thickness of 0.4 mm.

[0038] Using a blue light chip...

Embodiment 2

[0039] Embodiment 2: the temperature of first injection molding is at 190 o C, secondary molding temperature at 150 o c.

Embodiment 3

[0040] Example 3: The resin material is not limited, such as optical grade polycarbonate PC. Granulate before injection molding, different resins can adopt different injection molding process conditions.

[0041] Using a blue light chip grown on a 1W SiC substrate, the blue light emitted by the blue light chip irradiates the above-mentioned fluorescent resin inside to obtain bright white light (118-135 lm / W).

[0042] In the embodiment, the resin can be acrylic (PMMA), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, styrene-butadiene, phenylsulfone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC Good results can be obtained with reinforced PMMA or MS resins.

[0043] According to different requirements, the volume ratio of resin to phosphor is generally not limited, such as 100:1~100:150, generally 100:20~100:50.

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Abstract

The invention relates to a manufacturing method of a fluorescent resin component. The method comprises the steps of: adequately and uniformly mixing or prilling transparent or semi-transparent resin power and phosphor powder with the mass ratio of 100:1-100:150; heating and mould pressing a mixture of the transparent or semi-transparent resin and the phosphor and cooling to obtain a fluorescent resin panel. A white light LED (Light Emitting Diode) light emitting apparatus comprises a base, a blue light LED chip and resin containing the phosphor. The blue light LED chip is arranged on the base and faces the resin containing the phosphor. An electrode lead of the blue LED chip passes through the base. The resin is not directly contacted with a light emitting face of the blue chip, the radiating problem of the light emitting apparatus is alleviated, and the light emitting wavelength shift and light emitting efficiency decrease of the phosphor and the like caused by the radiating problem are avoided. The phosphor is separated from the blue light chip so that the light emitting loss caused by absorption of the light part stimulated by the phosphor re-entering the chip.

Description

technical field [0001] The invention relates to a fluorescent resin component, a manufacturing method, a white light emitting device and a manufacturing method. Background technique [0002] LED white light lighting is a high-efficiency green lighting technology with many advantages such as energy saving, environmental protection and long life. Its working principle is to use the combination of blue light chip and yellow phosphor powder (or other combination methods) to obtain white light. [0003] The traditional packaging of white light LED devices is to mix silica gel or resin with phosphor powder and then directly coat the surface of the blue light chip. This packaging technology has its inherent disadvantages. Since the silica gel (or resin) and the phosphor powder are in direct contact with the blue light chip, the scattering of the blue light chip is not smooth when it is working, and the high operating temperature of the chip will cause the luminous wavelength of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/00
Inventor 殷江钱志强金正武
Owner 镇江瑞吉光电科技有限公司
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