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Grooving method for multi-wire cutting of super-thick products by aid of guide wheels

A technology of multi-wire cutting and slotting method, which is applied in the direction of fine working devices, stone processing equipment, manufacturing tools, etc., can solve the problems of limited product varieties, jumping wires, and inability to process, and achieve the effect of expanding product capabilities

Active Publication Date: 2012-12-12
GRINM SEMICONDUCTOR MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a large included angle will lead to wire jumping, making it impossible to process, and the product variety is limited

Method used

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  • Grooving method for multi-wire cutting of super-thick products by aid of guide wheels
  • Grooving method for multi-wire cutting of super-thick products by aid of guide wheels
  • Grooving method for multi-wire cutting of super-thick products by aid of guide wheels

Examples

Experimental program
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Embodiment 1

[0016] For example, to cut a product with a thickness of 8mm, set the groove distance P = 8mm, and the system consists of 4 guide wheels. Using this method, first determine the distance A between the first groove of the first guide wheel and the reference plane of the guide wheel as 5mm; then the first The distance between the first groove of the 2 guide wheels and the reference surface of the guide wheels B=A+(C-1)+P / N=5+(2-1)*8 / 4=7mm; the first of the third guide wheel The distance between the groove and the reference plane of the guide wheel is B=9mm; the distance between the first groove of the fourth guide wheel and the reference plane of the guide wheel is B=11mm. In this way, the steel wire on each guide wheel will form a small angle (about 0.27°) with the wire groove, which avoids the occurrence of jumping wires.

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PUM

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Abstract

A grooving method for multi-wire cutting of super-thick products by the aid of guide wheels includes determining the position of a first groove of each guide wheel in a guide wheel set consisting of the multiple guide wheels; and determining sequence numbers of mounting positions of the guide wheels in a machine tool according to the sequence that steel wires contact with the guide wheel. The grooving method has the advantages that a groove gap of a super-thick silicon wafer is divided, so that an included angle between each steel wire and the corresponding guide wheel is reduced, wire skipping is prevented, and capability of the products is expanded. Besides, the method can be applied to slicing various materials with the sizes of 4 inches, 5 inches, 6 inches, 8 inches and 12 inches or with non-standard sizes.

Description

technical field [0001] The invention relates to a slotting method for a guide wheel (main roller or grooved wheel, hereinafter referred to as guide wheel) for cutting ultra-thick products in multi-wire cutting, especially in the application of multi-wire cutting machine in the processing of semiconductor materials to cut bars The production process of the film. A way to improve production efficiency and expand equipment capabilities. Background technique [0002] With the continuous development of the semiconductor industry, downstream manufacturers have put forward higher requirements for substrate materials. For applications in various fields, there is a demand for an ultra-thick product. At present, the multi-wire cutting method is often used to cut the bar to be processed into a sheet product with a certain thickness. In multi-wire cutting, equal-distance and equal-depth V-shaped grooves (hereinafter referred to as wire grooves) are engraved on the guide wheels, and t...

Claims

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Application Information

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IPC IPC(8): B28D5/04
Inventor 于晋京张立李晨安瑞阳
Owner GRINM SEMICONDUCTOR MATERIALS CO LTD
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