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Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof

A technology of copper-clad laminates and adhesives, applied in the field of laminates, can solve the problems of single color and inability to meet the diversity of high-performance UV-shielding copper-clad laminates, and achieve cost savings and the best comprehensive technology performance, excellent UV shielding function, and the effects of weather resistance

Active Publication Date: 2012-11-28
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the single color of the existing copper-clad laminates with ultraviolet shielding function, which are all yellow or brown, and cannot meet the needs of various types of high-performance UV shielding copper-clad laminates. sexually selected

Method used

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  • Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof
  • Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof
  • Copper foil clad laminated board with UV shielding function, adhesive and preparation methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The mass parts of the specific components of the adhesive are as follows:

[0042]

[0043] The preparation method of the adhesive: mix dimethylformamide and acetone and divide it into two parts of solvent 1 and solvent 2 in proportion, wherein the mass ratio of solvent 1 and solvent 2 is 10:1; first add dicyandiamide to solvent 1 Amine and 2-methylimidazole were stirred for 4 hours at a speed of 1000rpm; then bisphenol A epoxy resin, UV-9, talcum powder, magnesium hydroxide and barium sulfate were added in sequence, and the stirring speed was 4800rpm, stirring time is 45min, to make a mixture of solvent 1; at the same time, add fluorescent whitening agent FG to solvent 2, stir at a speed of 800rpm for 3h, to make a mixture of solvent 2; finally add it to the mixture of solvent 1 in 3 batches The solvent 2 mixture was stirred at a speed of 2000 rpm for 3 hours to prepare a copper-clad laminate adhesive.

[0044] The preparation method of the copper-clad laminate: im...

Embodiment 2

[0047] The mass parts of the specific components of the adhesive are as follows:

[0048]

[0049] The preparation method of the adhesive: mix dimethylformamide and propylene glycol methyl ether and divide it into two parts according to the proportion of solvent 1 and solvent 2, wherein the mass ratio of solvent 1 and solvent 2 is 15:1; Diaminodiphenylmethane, 2-ethyl-4-methylimidazole, stirred at a speed of 800rpm for 6h; then add bisphenol A epoxy resin, novolak epoxy resin, UV-326, titanium dioxide, aluminum hydroxide, Using high-shear dispersion stirring, the stirring speed is 4000rpm, and the stirring time is 45min to make a solvent 1 mixture; at the same time, add fluorescent whitening agent DT to solvent 2, and stir at a speed of 600rpm for 3h to make a solvent 2 mixture; finally The solvent 2 mixture was added to the solvent 1 mixture in two batches, and stirred at a speed of 2000 rpm for 2 hours to prepare an adhesive for copper-clad laminates.

[0050] The prepar...

Embodiment 3

[0053] The mass parts of the specific components of the adhesive are as follows:

[0054]

[0055] The preparation method of the adhesive: mix dimethylformamide and methyl ethyl ketone and divide them into two parts of solvent 1 and solvent 2 in proportion, wherein the mass ratio of solvent 1 and solvent 2 is 7.5:1; Cyanamide and 2-methylimidazole were stirred for 4 hours at a speed of 1000rpm; then organophosphorus epoxy resin, UV-214, aluminum hydroxide, and zinc oxide were added in sequence, and high-shear dispersion stirring was adopted at a stirring speed of 4000rpm. The time is 45min to make a mixture of solvent 1; at the same time, add fluorescent whitening agent YBP to solvent 2, stir at a speed of 800rpm for 3h to make a mixture of solvent 2; finally add the solvent to the mixture of solvent 1 in 3 batches 2 mixture, stirred at a speed of 1500rpm for 3h to prepare a copper-clad laminate adhesive.

[0056] The preparation method of copper-clad laminate: impregnate ...

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Abstract

The invention discloses a copper foil clad laminated board with UV shielding function and a preparation method thereof, and a copper foil clad laminated board adhesive and a preparation method thereof. The copper foil clad laminated board adhesive disclosed by the invention comprises the following components in parts by mass: 125-150 parts of resin, 25-42 parts of solvent, 2.1-3.6 parts of curing agent, 0.2-1.0 part of UV absorbent, 0.2-1.0 part of fluorescent whitening agent and 25-75 parts of auxiliary packing. The copper foil clad laminated board disclosed by the invention has various natural colors, and can satisfy diversified options for high-performance UV-shielding copper foil clad laminated boards; and meanwhile, the copper foil clad laminated board has excellent UV shielding function (the UV absorptivity exceeds 99.99%) and weather resistance, and is completely suitable for the development process of the PCB (printed circuit board) processing procedure and the AOI (automated optical inspection) detection technique of high-density integrated circuits. The preparation method of the copper foil clad laminated board has the characteristics of simple technique, favorable controllability, cost saving and the like.

Description

technical field [0001] The present invention relates to the field of laminates, in particular to the field of copper-clad laminates, in particular to a copper-clad laminate with an ultraviolet shielding function and a preparation method thereof, as well as the copper-clad laminate adhesive and a preparation method thereof . Background technique [0002] With the rapid development of the electronics industry, the production process of the printed circuit board (PCB), which is the "brain" of electronic products, has undergone rapid innovation. Especially in the manufacture of double-sided printed boards and multi-layer laminated boards, the production process is becoming more and more perfect, the application of optical development technology and liquid photosensitive solder resist has been promoted, and double-sided exposure processing technology is generally used. In order to avoid mutual interference and ghosting of the circuit patterns on both sides, the requirement for t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J171/10C09J175/04C09J11/06C09J11/04B32B37/10B32B37/06B32B7/12
Inventor 梁康荣胡瑞平常立荣
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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