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Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method

A technology for surface treatment and solder powder, applied in the field of ultra-fine powder solder paste and solder paste preparation technology, can solve the problems of high welding defect rate and poor wettability, and achieve low welding defect rate, good stability and high quality. Effect

Active Publication Date: 2012-11-21
DONGGUAN YONGAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The inventors of the present application have proved through experiments that when the oxygen content of the solder powder exceeds 150ppm, no matter how the formula of the flux in the solder paste is improved, the solder paste produced will have tin beads, poor wettability, and a high rate of defective soldering, etc. defect

Method used

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  • Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method
  • Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method
  • Surface treatment method for protecting superfine raw solder powder, and superfine powder solder paste prepared according to method

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Experimental program
Comparison scheme
Effect test

Embodiment 1～ Embodiment 6

[0051] Embodiment 1~Example 6 The surface treatment method of the original powder of superfine solder powder of the present invention

[0052] Proceed as follows:

[0053] a) Prepare the original powder of ultra-fine solder powder;

[0054] b) Use an organic acid treatment agent to treat the oxides on the surface of the ultra-fine solder powder, so that the oxygen content of the ultra-fine solder powder is lower than 150ppm to obtain a semi-finished product A;

[0055] c) The semi-finished product A is further treated with an anti-oxidation treatment agent to form a complex film on the surface of the semi-finished product A to obtain a semi-finished product B; the purpose of this step is to prevent the semi-finished product A from being oxidized again.

[0056] d) Dry the semi-finished product B in an oven at 30-40°C, and pack it with nitrogen gas to obtain superfine solder powder. Refer to Table 2 for the organic acid treatment agent and treatment time, and refer to Table 3...

Embodiment 1

[0057] The organic acid treatment of the surface of the former powder of ultrafine solder powder of the embodiment of the present invention 1-6 of table 2

[0058]

[0059]

[0060] Antioxidant treatment on the surface of the former powder of ultrafine solder powder of the embodiment of the present invention 1-6 of table 3

[0061]

[0062] In order to make those skilled in the art fully understand the surface treatment method of the original powder of ultrafine solder powder of the present invention and the preparation process of ultrafine solder paste, the inventor only uses the surface treatment method of the original powder of ultrafine solder powder in Embodiment 1 and Example 3 The process and the preparation process of ultra-fine solder paste are described in detail as follows. In other embodiments, the surface treatment process of the original powder of ultra-fine solder powder and the preparation process of ultra-fine solder paste can refer to the processes de...

Embodiment 3

[0065] The processing of the former powder of superfine solder powder in embodiment 3

[0066] First, 8 parts by weight of glutaric acid and 92 parts by weight of diethylene glycol dibutyl ether were uniformly stirred with a disperser to prepare an organic acid treatment solution. Then pour the original powder of Sn99.0Ag0.3Cu0.7 ultrafine solder powder with a particle size of 1 to 25 μm into a stainless steel container, and then pour the organic acid treatment solution prepared above. The amount of the treatment solution is to immerse the original ultrafine solder powder and Make sure that the ultra-fine solder powder is not exposed to the air, stir slowly with a stirring rod for 3 to 5 minutes, and then treat it statically for 50 hours. After the treatment is completed, pour out the supernatant to obtain a semi-finished product A; % Methylimidazole 50% acetone 45% ethanol solution, the amount added is to immerse the semi-finished product A and keep the semi-finished product ...

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Abstract

The invention provides a surface treatment method for protecting superfine raw solder powder, a superfine powder solder paste prepared according to the method, and a preparation technology of the solder paste, and belongs to the technical field of welding materials. The surface treatment method comprises the following steps: a), preparing superfine raw solder powder; b), adopting an organic acid treating agent to treat oxide on the surface of superfine raw solder powder till the oxygen content of the superfine raw solder powder is lower than 150 ppm, so as to obtain a semi-finished product A;c), further treating the semi-finished product A with an anti-oxidant treating agent till a complex compound film is generated on the surface of the semi-finished product A, so as to obtain a semi-finished product B; and d), placing the semi-finished product B into a 30 to 40 DEG C oven for drying, and charging nitrogen during packing, so as to obtain the superfine solder powder. The superfine solder powder is compounded with scaling powder to form the superfine powder solder paste. According to the invention, the technical defects of more tin beads, poor wettability, narrow PCB printing interval, and high welding defective rate of the superfine powder solder paste in the prior art are overcome.

Description

technical field [0001] The present invention relates to a processing method and preparation of solder powder, in particular to a surface treatment method of ultrafine solder powder and the preparation process of ultrafine powder solder paste and solder paste prepared therefrom, belonging to the technology of welding materials field. Background technique [0002] At present, with the rapid development of science and technology, all electronic products are developing towards thinner and smaller. The emergence of fine-pitch and ultra-fine-pitch surface mount technology for network, communication, and consumer electronics poses higher challenges to solder paste. Under the correspondence of fine pitch, high-precision placement machine, small components, and ultra-fine powder solder paste are applied. [0003] At present, the types of solder powder used for solder paste preparation on the market are Type2~Type4 powder, while Type5~Type6 powder is called ultrafine powder. The larg...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/363B22F1/00
Inventor 吴国齐刘明莲宣英男
Owner DONGGUAN YONGAN TECH
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