Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED (Light-Emitting Diode) packaging silica gel with high refractive index, light transmittance and power, and method for preparing same

A technology of LED packaging and high light transmittance, applied in adhesives, electrical components, circuits, etc., can solve the problems of low high temperature resistance and low thermal conductivity, and achieve the effects of long storage period, high strength and high refractive index

Inactive Publication Date: 2012-11-14
邵成芬
View PDF5 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as a widely used packaging material, it also has its inherent disadvantages, that is, very low thermal conductivity and low temperature resistance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0018] The preparation method of the present invention comprises:

[0019] 1) Weigh the parts of the above materials respectively;

[0020] 2) Preparation of component A as the main agent: put phenyl vinyl polysiloxane and phenyl silicone oil into the reaction vessel, stir, feed N2 (i.e. nitrogen gas), and raise the temperature to 120-150°C; Then add quick-drying agent, light stabilizer and antioxidant, continue stirring and mixing for 120-180 minutes, stop feeding N2 and stirring; then vacuumize and defoam for 80-120 minutes; finally, stop vacuuming, and discharge after cooling , Packaged as component A of the finished product;

[0021] 3) Preparation of component B as a curing agent: Add phenyl vinyl polysiloxane and phenyl hydrogen polysiloxane into the reaction vessel, stir, feed N2, and heat up to 120-150°C Add retarder, defoamer and ultraviolet absorber, continue stirring and mixing for 120 to 180 minutes, stop feeding N2 and stirring; then vacuumize and defoam for 80 ...

Embodiment 1

[0023] Component A as the main agent, including: 100 parts of phenyl vinyl polysiloxane with a viscosity of 5.0 cp, 50 parts of phenyl silicone oil with a viscosity of 5.0 cp, and 5 parts of a silicone oil compound with a platinum content of 50 ppm as quick-drying agent, 10 parts of light shielding agent with a viscosity of 5.0cp as a light stabilizer, and 5 parts of didodecanol thiodipropionate

[0024] Component B (curing agent), including: 100 parts of phenyl vinyl polysiloxane with a viscosity of 5.0 cp, 40 parts of phenyl hydrogen-containing polysiloxane with a viscosity of 5.0 cp, 5 alkynyl alcohols with a viscosity of 5.0 cp Parts, 5 parts of alcohols with a viscosity of 5.0cp, 5 parts of bisphenol A disalicylate

[0025] Preparation of component A (main agent): Put the above-mentioned parts of vinyl phenyl polysiloxane polymer and phenyl silicone oil into the reaction vessel, stir, pass in N2, heat up to 120°C, add platinum fast Dry agent, light stabilizer and antiox...

Embodiment 2

[0028] Component A as the main agent, including: 100 parts of phenyl vinyl polysiloxane with a viscosity of 900000.0cp, 40 parts of phenyl silicone oil with a viscosity of 900000.0cp, and 4 parts of a silicone oil compound with a platinum content of 10000ppm as a quick-drying agent, 8 parts of benzophenones with a viscosity of 50000.0cp as a light stabilizer, and 4 parts of dioctadecyl thiodipropionate

[0029] Component B (curing agent), including: 100 parts of phenyl vinyl polysiloxane with a viscosity of 5.0 cp, 30 parts of phenyl hydrogen-containing polysiloxane with a viscosity of 5.0 cp, and alkyne oxygen with a viscosity of 5.0 cp 4 parts of polysiloxane, 4 parts of phosphate esters with a viscosity of 5.0 cp, and 4 parts of 2-hydroxy-4-methoxybenzophenone.

[0030]Preparation of component A (main ingredient): Put the above-mentioned parts of vinyl phenyl polysiloxane polymer and phenyl silicone oil into the reaction vessel, stir, pass in N2, raise the temperature to 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
refractive indexaaaaaaaaaa
Login to View More

Abstract

An LED (Light-Emitting Diode) packaging silica gel with high refractive index, light transmittance and power is composed of two adhesives A and B according to parts by weight, wherein the adhesive A comprises the following components: phenyl vinyl polysiloxane, phenyl silicone, a quick-drying agent, a light stabilizer and an antioxidant; and the adhesive B comprises the following components: phenyl vinyl polysiloxane, phenyl hydrogen polysiloxane, a retarder, a defoamer and an ultraviolet absorber. The LED packaging silica gel employs a two-component packaging manner; the production process of the LED packaging silica gel is simple and easy to implement; the storage of the LED packaging silica gel is convenient without special requirement for the environment; and the period of storage is long, and production is facilitated. In use, the silica gel formed through simple blending is good in bonding strength, high in strength, high in light transmittance and refractive index, and has the advantages of being excellent in high-temperature resistance, good in aging and weather resistance and the like.

Description

【Technical field】 [0001] The invention relates to an organic silica gel and a preparation method thereof, in particular to a high-refractive-index, high-transmittance, high-power LED packaging silica gel used for packaging LED lighting lamps and a preparation method thereof. 【Background technique】 [0002] In the field of packaging of optoelectronic components LEDs, polymer silicone materials are used due to their advantages such as better physical properties, good mechanical properties, and low price, and they also have corrosion resistance, heat resistance, high transparency, and can be produced Materials with different hardness and different physical properties, etc. However, as a widely used packaging material, it also has its inherent disadvantages, namely very low thermal conductivity and low high temperature resistance. As we all know, the heat generated by optoelectronic devices increases with the increase of their power. Due to the low thermal conductivity of polym...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05H01L33/56
Inventor 邵成芬
Owner 邵成芬
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com