Method for recovering water-soluble cutting fluid from silicon wafer cutting fluid

Abstract

The invention discloses a method recovering a water-soluble cutting fluid from a silicon wafer cutting fluid. The water-soluble cutting fluid is recycled by agitating, separating, decolorizing and evaporating the silicon wafer cutting fluid in a vacuum state. The method is convenient to operate, the water-soluble cutting fluid processed by the method has high utilization rate, the quality and production efficiency of silicon wafers are increased, high precision processing below TTV 10 mum is realized, and the qualified rate for cutting silicon wafers is more than 98%. When the water-soluble cutting fluid recovered by using the method is used during 1 mm / min high-speed cutting of emery wires, the production capacity is more than 2 times higher than that of the suspension mortar cutting way of the traditional machine. In addition, not only is the economic efficiency of an enterprise increased, but also the pollution caused by polyethylene glycol and silicon carbide is reduced, the emission amount of CO is greatly reduced, and environmental resources are protected.

Description

technical field [0001] The invention relates to an extraction method, in particular to a method for extracting water-soluble cutting fluid from silicon chip cutting fluid. Background technique [0002] Silicon wafers are semiconductors and the basic materials for solar energy and liquid crystal displays. With the development of solar energy, the use of silicon wafers is increasing. Since silicon wafer is a hard material, its cutting process occupies a very important position in the processing technology. Traditional silicon wafer cutting adopts the method of steel sheet cutting, which has defects such as wide kerf, low yield, poor surface shape accuracy and deep surface damage. In order to solve the above problems, wire cutting has recently appeared. The mortar with abrasive is supplied through the cutting wire, and the cutting of silicon wafers is realized through the principle of abrasive wear between abrasives, cutting wires and silicon crystals. This method can realize...

AI Technical Summary

Problems solved by technology

Combining the above two methods, both have environmental pollution caused by polyethylene glycol and silicon carbide, and the traditional polyethylene glycol and silicon carbide have large pollution in the recycling process, and the slicing efficiency is low in the cutting process

In addition, the efficiency and quality of cutting fluid are low, and the recycling effect is poor

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