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Non-volatile memory with P+ floating gate electrode and preparation method thereof

A non-volatile, memory technology, applied in the direction of electrical solid-state devices, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of easy loss of written data, influence on reliability, and complexity, so as to improve data storage time and improve The effect of using reliability and reducing the cost of use

Active Publication Date: 2012-10-10
浙江锋华创芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The combination of non-volatile memory (NVM) technology and traditional logic technology will make the process a more complex and expensive combination; since the typical usage of NVM for SoC applications is in relation to the overall The chip size is small, so this practice is not advisable
At the same time, due to the working principle of the existing non-volatile memory, the written data is easily lost, which affects the reliability of use

Method used

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  • Non-volatile memory with P+ floating gate electrode and preparation method thereof
  • Non-volatile memory with P+ floating gate electrode and preparation method thereof
  • Non-volatile memory with P+ floating gate electrode and preparation method thereof

Examples

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Effect test

Embodiment 1

[0068] Such as figure 1 with Figure 13 Shown: In order to make the non-volatile memory compatible with the CMOS logic process and enable the non-volatile memory to store for a longer period of time, the non-volatile memory includes a P conductivity type substrate 1, a P conductivity type substrate 1 The material is silicon. At least one memory cell 100 is provided on the upper part of the P conductivity type substrate 1, and the memory cell 100 includes a PMOS access transistor 110, a control capacitor 120 and a programming capacitor 130, and a gate electrode is deposited on the surface of the P conductivity type substrate 1. The dielectric layer 15 , the gate dielectric layer 15 covers the surface corresponding to the memory cell 100 , and the PMOS access transistor 110 , the control capacitor 120 and the programming capacitor 130 are isolated from each other by the domain dielectric region 14 in the P conductivity type substrate 1 . The domain dielectric region 14 is loca...

Embodiment 2

[0099] Such as figure 2 with Figure 25Shown: In this embodiment, the semiconductor substrate is an N-conductive type substrate 39. When the N-conductive type substrate 39 is used, there is no need to form the second N-type region 3 in the N-conductive type substrate 39, that is, the second P-type region 5 and the second P-type region 5. The three P-type regions 31 are in direct contact with the N-type conductivity type substrate 39 , and at the same time, the first N-type region 2 and the third N-type region 4 are also in direct contact with the N-type conductivity type substrate 39 . After adopting the N conductive type substrate 39 , the rest of the structure is the same as that of Embodiment 1.

[0100] Such as Figure 15~Figure 25 Shown: the non-volatile memory of the above structure can be realized through the following process steps, specifically:

[0101] a. An N conductive type substrate 39 is provided, and the N conductive type substrate 39 includes a first main ...

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Abstract

The invention relates to a non-volatile memory with a P+ floating gate electrode and a preparation method of the non-volatile memory with the P+ floating gate electrode. A memory cell is arranged at the upper part in a semiconductor substrate and comprises a PMOS (P-Channel Metal Oxide Semiconductor) access transistor, a control capacitor and a programming capacitor; a plurality of isolation grooves are arranged at the upper part of the semiconductor substrate, and isolation mediums are arranged in the isolation grooves so as to form field medium regions; the PMOS access transistor, the control capacitor and the programming capacitor in the memory cell are isolated from each other by the field medium regions; a gate dielectric layer is deposited on a first main surface of the semiconductor substrate, and covers the openings of the isolation grooves and the first main surface of the semiconductor substrate; and P+ floating gate electrodes are arranged right above the vertex angles of the isolation grooves on the two sides of the PMOS access transistor and the control capacitor, are positioned on the gate dielectric layer and are corresponding to the vertex angles of the corresponding isolation grooves. According to the non-volatile memory and the preparation method, the non-volatile memory and a CMOS (Complementary Metal Oxide Semiconductor) process are compatible, so that the data retention period is prolonged, and the using reliability of the non-volatile memory is improved.

Description

technical field [0001] The present invention relates to a kind of non-volatile memory and its preparation method, especially a kind of non-volatile memory with P+ floating gate electrode and its preparation method, specifically a kind of non-volatile memory which can improve data retention time A memory and a preparation method thereof belong to the technical field of integrated circuits. Background technique [0002] For system-on-chip (SoC) applications, it is the integration of many functional blocks into an integrated circuit. The most common SoCs include a microprocessor or microcontroller, static random access memory (SRAM) modules, non-volatile memory, and logic blocks for various special functions. However, conventional non-volatile memory processes, which typically use stacked-gate or split-gate memory cells, are not compatible with conventional logic processes. [0003] Non-volatile memory (NVM) technology is different from traditional logic technology. The comb...

Claims

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Application Information

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IPC IPC(8): H01L27/115H01L21/762H01L21/8247
Inventor 方英娇方明
Owner 浙江锋华创芯微电子有限公司
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