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Non-volatile memory for improving data storage time and method for producing non-volatile memory

A non-volatile, data storage technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of easy loss of written data, affect reliability, complexity, etc., to improve data storage time, The effect of improving the reliability of use and reducing the cost of use

Active Publication Date: 2015-06-17
浙江锋华创芯微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The combination of non-volatile memory (NVM) technology and traditional logic technology will make the process a more complex and expensive combination; since the typical usage of NVM for SoC applications is in relation to the overall The chip size is small, so this practice is not advisable
At the same time, due to the working principle of the existing non-volatile memory, the written data is easily lost, which affects the reliability of use

Method used

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  • Non-volatile memory for improving data storage time and method for producing non-volatile memory
  • Non-volatile memory for improving data storage time and method for producing non-volatile memory
  • Non-volatile memory for improving data storage time and method for producing non-volatile memory

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Experimental program
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Embodiment 1

[0068] Such as figure 1 and Figure 13 Shown: In order to make the non-volatile memory compatible with the CMOS logic process and enable the non-volatile memory to store for a longer period of time, the non-volatile memory includes a P conductivity type substrate 1, a P conductivity type substrate 1 The material is silicon. At least one memory cell 100 is provided on the upper part of the P conductivity type substrate 1, and the memory cell 100 includes a PMOS access transistor 110, a control capacitor 120 and a programming capacitor 130, and a gate electrode is deposited on the surface of the P conductivity type substrate 1. The dielectric layer 15 , the gate dielectric layer 15 covers the surface corresponding to the memory cell 100 , and the PMOS access transistor 110 , the control capacitor 120 and the programming capacitor 130 are isolated from each other by the domain dielectric region 14 in the P conductivity type substrate 1 . The domain dielectric region 14 is locat...

Embodiment 2

[0099] Such as figure 2 and Figure 25Shown: In this embodiment, the semiconductor substrate is an N-conductive type substrate 39. When the N-conductive type substrate 39 is used, there is no need to form the second N-type region 3 in the N-conductive type substrate 39, that is, the second P-type region 5 and the second P-type region 5. The three P-type regions 31 are in direct contact with the N-type conductivity type substrate 39 , and at the same time, the first N-type region 2 and the third N-type region 4 are also in direct contact with the N-type conductivity type substrate 39 . After adopting the N conductive type substrate 39 , the rest of the structure is the same as that of Embodiment 1.

[0100] Such as Figure 15~Figure 25 Shown: the non-volatile memory of the above structure can be realized through the following process steps, specifically:

[0101] a. An N conductive type substrate 39 is provided, and the N conductive type substrate 39 includes a first main s...

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Abstract

The invention relates to a non-volatile memory for improving the data storage time and a method for producing the non-volatile memory, wherein a memory cell is arranged at the inner upper part of a semiconductor baseplate of the non-volatile memory; the memory cell comprises a P-channel metal oxide semiconductor (PMOS) access transistor, a control capacitance and a programmable capacitance; a plurality of isolation grooves are arranged at the inner upper part of the semiconductor baseplate, and isolation dielectric is filled in the isolation grooves for forming domain dielectric areas; the PMOS access transistor, the control capacitance and the programmable capacitance which are arranged in the memory cell are isolated from each other through the domain dielectric areas; a gate dielectric layer is deposited on a first primary side of the semiconductor baseplate, and covers the openings of the isolation grooves and the first primary side of the semiconductor baseplate; and P plus floating gate electrodes are arranged at the two sides of the PMOS access transistor and the programmable capacitance, are positioned on the gate dielectric layer and correspond to the vertical angles of the corresponding isolation grooves. The non-volatile memory can be compatible to a complementary metal oxide semiconductors (CMOS) logic technology, the data retention time is prolonged, and the use reliability of the non-volatile memory is improved.

Description

technical field [0001] The invention relates to a non-volatile memory and a preparation method thereof, in particular to a non-volatile memory with improved data storage time and a preparation method thereof, belonging to the technical field of integrated circuits. Background technique [0002] For system-on-chip (SoC) applications, it is the integration of many functional blocks into an integrated circuit. The most common SoCs include a microprocessor or microcontroller, static random access memory (SRAM) modules, non-volatile memory, and logic blocks for various special functions. However, conventional non-volatile memory processes, which typically use stacked-gate or split-gate memory cells, are not compatible with conventional logic processes. [0003] Non-volatile memory (NVM) technology is different from traditional logic technology. The combination of non-volatile memory (NVM) technology and traditional logic technology will make the process a more complex and expen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/115H01L21/8247
Inventor 方英娇方明
Owner 浙江锋华创芯微电子有限公司
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