Pure copper plate production method, and pure copper plate

Abstract

Disclosed is a pure copper plate production method wherein post-hot-forging and post-hot-rolling cold forging and cold rolling, and subsequent heat processing are unnecessary. Further disclosed is a pure copper plate having a fine structure which is obtained according to the disclosed production method and which is provided with a high special grain boundary ratio due to the formation of a twin crystal structure by means of partial recrystalisation, and is particularly suitable for copper target members for sputtering, or anodes for plating, or similar. A pure copper ingot having a purity level of 99.96 weight% or higher is heated to 550-800°C. A hot-rolling process is carried out wherein the total rolling rate is 85% or higher, the temperature at rolling completion is 500-700°C, and which includes at least one finishing rolling pass having a rolling reduction rate for one pass of 5-24%. Then, rapid cooling from the rolling completion temperature to 200°C or lower is carried out at a cooling speed of 200-1000°C / min, as required.

Description

technical field [0001] The present invention relates to a method of manufacturing a pure copper sheet having good quality, and in particular to a method of manufacturing a pure copper sheet having a fine structure and utilizing a partial recrystallization to form a twin crystal structure to impart a high special grain boundary ratio, and by The pure copper plate produced by this production method is suitable as a copper target material for sputtering, an anode material for electroplating, and the like. [0002] this application claims priority based on Japanese Patent Application No. 2010-26455 for which it applied on February 9, 2010, and uses the content here. Background technique [0003] A pure copper sheet is usually produced by hot rolling or hot forging a pure copper ingot, then performing cold rolling or cold forging, and then performing heat treatment for stress relief or recrystallization to manufacture a pure copper sheet. Such pure copper plates are processed in...

AI Technical Summary

Problems solved by technology

[0013] In the existing method of industrially manufacturing large-scale pure copper plates with a uniform and stable crystal structure, it is necessary to further implement cold forging, cold rolling, and heat treatment after hot forging and hot rolling of pure copper ingots, but for spattering Suppression of abnormal discharge in high-output sputtering of shooting targets, improvement of uniform solubility in plating anodes, and thermal fatigue resistance in exothermic substrates are difficult to deal with only by miniaturization

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