Patterned substrate of LED chip and LED chip
A technology for LED chips and patterned substrates, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as failure to prepare new patterns, GaN growth quality damage, etc., to improve internal quantum efficiency and epitaxy quality , The effect of excellent light extraction efficiency
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Embodiment 1
[0026] figure 1 Be the schematic diagram of the LED chip of this embodiment, as figure 1 As shown, it consists of a patterned sapphire substrate 11, an N-type GaN layer 12, an MQW quantum well layer 13, and a P-type GaN layer 14 arranged in sequence.
[0027] Such as figure 2 As shown, in the patterned substrate of the LED chip of this embodiment, the pattern of the substrate is composed of a plurality of spherical caps of the same shape arranged on the surface of the substrate, and the height h of each spherical cap is the radius of the sphere corresponding to the spherical cap. 75% of R; the edge spacing d of adjacent spherical caps is 30% of the bottom surface radius r of the spherical caps; the radius R of the sphere corresponding to the spherical caps in this embodiment is 2 μm; the plurality of spherical caps of the same shape use as image 3 The rectangular arrangement shown.
[0028] Figure 4 It is a schematic diagram of changing the optical path of the spherica...
Embodiment 2
[0030] In the patterned substrate of the LED chip of this embodiment, the pattern of the substrate is composed of a plurality of spherical caps of the same shape arranged on the surface of the substrate, and the height h of each spherical cap is 85% of the radius R of the sphere corresponding to the spherical cap. %; the edge spacing d of adjacent spherical caps is 50% of the bottom surface radius r of the spherical caps; the radius R of the sphere corresponding to the spherical caps in this embodiment is 3.5 μm; the plurality of spherical caps with the same shape are used as Figure 5 The hexagonal arrangement shown.
Embodiment 3
[0032] In the patterned substrate of the LED chip of this embodiment, the pattern of the substrate is composed of a plurality of spherical caps of the same shape arranged on the surface of the substrate, and the height h of each spherical cap is 80% of the radius R of the sphere corresponding to the spherical cap. %; the edge spacing d of adjacent spherical caps is 40% of the radius r of the bottom surface of the spherical caps; the radius R of the sphere corresponding to the spherical caps in this embodiment is 3 μm; the plurality of spherical caps with the same shape adopts a hexagonal arrangement Way.
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