Substrate for power module and manufacturing method, the substrate and power module with built-in heat sink

A technology of power modules and substrates, which is applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as interface peeling, and achieve the effect of preventing cracks

Active Publication Date: 2016-07-06
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, even when the surface roughness is adjusted to Ra=0.1 μm or less by polishing, interfacial peeling may occur in the same manner.

Method used

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  • Substrate for power module and manufacturing method, the substrate and power module with built-in heat sink
  • Substrate for power module and manufacturing method, the substrate and power module with built-in heat sink
  • Substrate for power module and manufacturing method, the substrate and power module with built-in heat sink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0099] A comparative experiment performed to confirm the effectiveness of the present invention will be described.

[0100] A 4N aluminum circuit layer with a thickness of 0.6 mm and a 4N aluminum metal layer with a thickness of 0.6 mm were joined to a ceramic substrate made of AlN with a thickness of 0.635 mm to produce a substrate for a power module.

[0101] Here, Cu and additive elements are fixed on the bonding surface of the aluminum plate (4N aluminum) to be the circuit layer and the metal layer to form an anchor layer, and the metal plate and the ceramic substrate are laminated and heated under pressure to join the metal plate and the ceramic substrate. .

[0102] Furthermore, various test pieces in which the added elements to be fixed were changed were produced, and the bonding reliability was evaluated using these test pieces. As an evaluation of bonding reliability, the bonding rate after repeating 2000 cycles of cooling and heating (-45°C to 125°C) was compared. ...

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Abstract

The present invention provides a substrate for a power module in which a metal plate and a ceramic substrate are reliably bonded and has high thermal cycle reliability, a power module including the substrate for a power module, and a method for manufacturing the substrate for a power module. A substrate (10) for a power module, wherein an aluminum metal plate (12, 13) is laminated and bonded to a surface of a ceramic substrate (11), wherein, in the metal plate (12, 13), other than Cu In addition, one or two or more additional elements selected from Zn, Ge, Ag, Mg, Ca, Ga and Li are solid-dissolved. In the metal plates (12, 13), the contact with the ceramic substrate (11) The total concentration of Cu in the vicinity of the interface and the concentration of the added element is set within a range of not less than 0.05% by mass and not more than 5% by mass.

Description

technical field [0001] The present invention relates to a substrate for a power module used in a semiconductor device that controls large current and high voltage, a substrate for a power module with a heat sink, a power module including the substrate for a power module, and a method for manufacturing the substrate for a power module . Background technique [0002] Since the power element used for power supply among semiconductor elements has a relatively high heat generation, as the substrate on which the power element is mounted, for example, as shown in Patent Document 1, the following substrate for a power module is used: a substrate made of AlN (nitrided An Al (aluminum) metal plate is bonded to a ceramic substrate made of aluminum) by brazing. [0003] And, this metal plate is formed as a circuit layer, and a power element (semiconductor element) is mounted on the metal plate via solder. [0004] In addition, it has been proposed to bond a metal plate such as Al or t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/485H01L23/36H01L21/48
CPCH01L2224/32225
Inventor 殿村宏史长友义幸黑光祥郎
Owner MITSUBISHI MATERIALS CORP
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