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Polysiloxane for semiconductor packaging adhesive

A polysiloxane and encapsulant technology, applied in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problems of poor light transmittance, yellowing, and brittle epoxy resin.

Active Publication Date: 2012-08-22
小禾电子材料(德清)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional semiconductor components are packaged with epoxy resin, but yellowing will occur during use, which will make the light transmittance worse. The epoxy resin will become brittle and its strength will decrease after repeated use.
In order to solve the above problems, silicone-modified epoxy resin composition, silica gel, etc. are used as packaging materials for semiconductor elements, which improves the UV and thermal aging resistance. However, with the continuous increase in the power of semiconductor elements, silicone modified The epoxy resin encapsulation material still can not satisfy the requirement of semiconductor components, the introduction of phenyl in the semiconductor encapsulation glue raw material involved in the present invention solves the above problems preferably

Method used

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  • Polysiloxane for semiconductor packaging adhesive
  • Polysiloxane for semiconductor packaging adhesive

Examples

Experimental program
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Effect test

preparation example Construction

[0032] 1. Preparation of polysiloxane A

[0033] The present invention relates to the general structural formula of polysiloxane A:

[0034]

[0035] Where R 1 Is an alkyl group, such as methyl, ethyl, propyl, butyl, etc., preferably methyl; R 2 Is an alkyl or alkenyl group, such as methyl, vinyl, allyl, butenyl, etc., preferably vinyl; R 3 It is an aryl group, such as phenyl, tolyl, naphthyl, etc., preferably phenyl. a+b+c+d+e=100, a=1~20, b=0~20, c=0~20, d=0~20, e=30~60.

[0036] The present invention relates to a preparation method of polysiloxane A: adding catalyst, solvent, end-capping agent, methylsiloxane, methylvinylsiloxane, and phenylsiloxane dropwise while stirring at room temperature or under heating Phenyltrialkoxysilane, after dripping the phenyltrialkoxysilane, react at room temperature or heating for 3~18 hours, stand still, separate the upper acid water, wash the lower oil phase with water, and wash the oil phase to the middle After removing the low component at 1...

Embodiment 1

[0044] Put 20g of 30% sulfuric acid, 54g of toluene, 40g of hexamethyldisiloxane, 22g of octamethylcyclotetrasiloxane and 26g of tetramethyltetravinylcyclotetrasiloxane into a four-necked flask, start stirring, Slowly add phenyltrimethoxysilane dropwise, after dropping 178g of phenyltrimethoxysilane, react at room temperature for 18 hours, stand still, separate the upper acid water, wash the lower oil phase with water, and wash the oil phase to neutral , And then unplug the low distillate at 150°C and -0.099Mpa to obtain a colorless and transparent product A1.

Embodiment 2

[0046] Put 25g of 30% sulfuric acid, 107g of toluene, 30g of hexamethyldisiloxane, 88g of dimethyldimethoxysilane and 49g of tetramethyltetravinylcyclotetrasiloxane into a four-necked bottle, and set it to reflux Turn on the tube, stir, and start adding phenyltrimethoxysilane slowly. After dropping 400g of phenyltrimethoxysilane, stir at room temperature for 16 hours, then stand still, separate the upper layer of acid water, and wash the lower oil phase with water , Wash the oil phase to neutral, then pull out the low distillate at 150°C and -0.099Mpa to obtain a colorless and transparent product A2.

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Abstract

The invention relates to a semiconductor packaging adhesive, and particularly relates to polysiloxane for the semiconductor packaging adhesive. According to the polysiloxane for the semiconductor packaging adhesive, in the polysiloxane, each of molecules at least includes one alkylene and aryl which are connected with silicon, and the structural formula is as follows: (R1R2 2silicon monoxide / 2) a*(R1 2silica / 2) b*(R1R2 silica / 2) c*(R3 silica / 2) d*(R3silicic acid / 2) e, wherein R1 represents alkyl, R2 represents alkylene and R3 represents aryl, a+b+c+d+e=100, a=(1-20), b=(10-20), c=(10-20), d=(0-10), and e=(30-60). According to the polysiloxane for the semiconductor packaging adhesive, in general, polysiloxane compositions are cured by heating, after the curing, a refractive index of visible lights at the temperature of 25 DEG C is not less than 1.5, and light transmittance is not less than 90%, so that the polysiloxane for the semiconductor packaging adhesive has the advantages of being high in refractive index, transmittance and physical strength, anti-yellowing, resistant to ultraviolet radiation and thermal aging.

Description

technical field [0001] The invention relates to a semiconductor encapsulation glue, in particular to a polysiloxane used in the semiconductor encapsulation glue. Background technique [0002] Traditional semiconductor components are packaged with epoxy resin, but yellowing will occur during use, resulting in poor light transmission. The epoxy resin tends to become brittle and its strength decreases during repeated use. In order to solve the above problems, silicone-modified epoxy resin composition, silica gel, etc. are used as packaging materials for semiconductor elements, which improves the UV and thermal aging resistance. However, with the continuous increase in the power of semiconductor elements, silicone modified The epoxy resin encapsulation material still cannot meet the requirements of semiconductor components, and the introduction of phenyl group into the semiconductor encapsulation adhesive raw material involved in the present invention solves the above problems b...

Claims

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Application Information

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IPC IPC(8): C08G77/20C08G77/06C09J183/07C09J183/05C09K3/10
Inventor 许银根
Owner 小禾电子材料(德清)有限公司
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