Moderate temperature copper-based solder and preparation method thereof

Abstract

A moderate temperature copper-based solder and a preparation method thereof relate to a solder and a preparation method thereof. According to the moderate temperature copper-based solder and the preparation method thereof, the technical problems that the current copper-based solder has great brittleness, cannot be processed into solder wires nor brazed with steel and stainless steel, and is more likely to generate poisonous zinc vapour are solved. The moderate temperature copper-based solder is prepared from Cu, Zn, Mn, Si, Sn, Ni, La and Ce. The method comprises the following steps of: 1, weighing materials, 2, preparing rare earth intermediate alloy; 3, smelting moderate temperature copper-based solder to obtain metal ingot; and 4, extruding the metal ingot to obtain the moderate temperature copper-based solder. The moderate temperature copper-based solder does not contain silver, Ga, In and other noble metal elements, so the preparation cost is low. The moderate temperature copper-based solder does not contain any poisonous elements, is safe and reliable to use and has high brazing mechanical property; and at room temperature, the moderate temperature copper-based solder can be applied to the brazing of steel, stainless steel and other black metals due to high mechanical property.

Description

technical field [0001] The invention relates to a solder and a preparation method thereof. Background technique [0002] With the development of modern industrial technology, especially the development of aerospace, automobile, microelectronics and other industrial technologies, brazing technology has developed rapidly with its unique advantages, and has become one of the most active and promising fields. And solder has also obtained great demand as the soldering material of brazing. In the past, silver-based cadmium-containing solder has been widely used, because the addition of Cd in silver-based solder can significantly reduce the liquidus of the alloy, narrow the melting temperature range, and improve the fluidity and wettability of the solder. , thus effectively improving the brazing process. According to the preliminary statistics of relevant departments, in 2005 alone, the domestic consumption of cadmium in silver-based solder reached 250 tons. However, the extensi...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a medium-temperature copper-based solder and its preparation method in order to solve the technical problems that the existing copper-based solder is brittle, cannot be processed into welding wire, cannot be brazed with steel and stainless steel, and is prone to produce toxic zinc vapor

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