Fluorescent substance, process for producing same, and luminescent device including same
A technology for a light-emitting device and a manufacturing method, applied in the field of phosphors, capable of solving problems such as increased calorific value, color rendering deviation, and reduced luminous brightness
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no. 1 approach
[0239] As a first embodiment of the light-emitting device of the present invention, a cannonball-shaped white light-emitting diode lamp (LED lighting device: LED device) will be described.
[0240] figure 1 It is a cross-sectional view of a cannonball-shaped white light-emitting diode lamp 1 that is a first embodiment of the light-emitting device of the present invention.
[0241] Such as figure 1 As shown, the cannonball-shaped white light-emitting diode lamp 1 has a first lead 2 and a second lead 3, the first lead 2 has a recess 2a, and a light-emitting diode element (LED chip) 4 is built in the recess 2a. In the light emitting diode element 4 , the lower electrode 4 a is electrically connected to the bottom surface of the concave portion 2 a through a conductive paste, and the upper electrode 4 b is electrically connected to the second lead 3 through a bonding wire (fine gold wire) 5 .
[0242] The first resin (encapsulating resin) 6 is a transparent resin in which phosph...
no. 2 approach
[0249] As a second embodiment of the light-emitting device of the present invention, a chip-type white light-emitting diode lamp for substrate mounting (LED lighting device: LED device) will be described.
[0250] figure 2 It is a cross-sectional view of a chip-type white light-emitting diode lamp 11 for substrate mounting that is a second embodiment of the light-emitting device of the present invention.
[0251] Such as figure 2 As shown, the chip-type white light-emitting diode lamp 11 for substrate mounting is fixed with a first lead 12 and a second lead 13 on a ceramic substrate 19 made of white alumina ceramics with high reflectance of visible light. 13a is located in the approximate center of the substrate 19, and the ends 12b and 13b on the opposite side protrude to the outside, respectively, and serve as electrodes to be soldered when mounted on the electric substrate. The end 12 a of the first lead 12 is fixed with a built-in light emitting diode element (LED chip...
no. 3 approach
[0259] As a second embodiment of the light-emitting device of the present invention, a chip-type white light-emitting diode lamp for substrate mounting (LED lighting device: LED device) will be described.
[0260] image 3 It is a cross-sectional view of a chip-type white light-emitting diode lamp 111 for substrate mounting that is a third embodiment of the light-emitting device of the present invention.
[0261] Such as image 3 As shown, the chip-type white light-emitting diode lamp 111 for substrate mounting is fixed with a first lead 12 and a second lead 13 on a ceramic substrate 19 made of white alumina ceramics with high reflectance of visible light. 13a is located in the approximate center of the substrate 19, and the ends 12b and 13b on the opposite side protrude to the outside, respectively, and serve as electrodes to be soldered when mounted on the electric substrate. The end 12 a of the first lead 12 is fixed by incorporating a light emitting diode element (LED ch...
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Abstract
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