Method for producing piezoelectric electret functional films with piezoelectric coefficient d31
A technology of piezoelectric electret and piezoelectric coefficient, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., to achieve a simple and feasible process Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] Embodiment 1 According to the following steps, the piezoelectric coefficient d 31 FEP composite film piezoelectric electret 1 .
[0022] 1. Carve on a 5cm*5cm metal plate such as figure 1 In the groove structure shown, the groove depth is 1mm, the width is 1mm, and the distance between the two grooves is 0.5mm, forming a mold with the groove structure.
[0023] 2. First, put the grooved side of the mold (mould 1) facing up, and cover the surface of mold 1 with a commercially available FEP film with a thickness of 12.5 um, a rubber film with a thickness of 1mm, and A 3mm thick stainless steel plate, and then place them together on the heating plate of the heat press, at a temperature and pressure of 120 o C and 11MPa, pressurize for 1min, and finally remove the stainless steel plate and the rubber film to obtain the FEP film 1 attached to the surface of the mold 1 and having a groove structure.
[0024] 3. Using the method described in step 2 to obtain the FEP film ...
Embodiment 2
[0034] Example 2 According to the following steps, the piezoelectric coefficient d 31 FEP composite film piezoelectric electret 2 .
[0035] 1. Carve on a 5cm*5cm metal plate such as figure 1 In the groove structure shown, the groove depth is 1mm, the width is 0.5mm, and the distance between the two grooves is 0.25mm, forming a mold with the groove structure.
[0036] 2. First, put the grooved side of the mold (mould 3) upward, and cover a commercially available FEP film with a thickness of 12.5 um, a rubber film with a thickness of 1mm, and a 3mm thick stainless steel plate, and then they are placed together on the heating plate of the heat press, at a temperature and pressure of 100 o C and 11 MPa under pressure for 2 minutes, and finally remove the stainless steel plate and the rubber film to obtain the FEP film 3 attached to the surface of the mold 3 and having a groove structure.
[0037] 3. Use the method described in step 2 to obtain the FEP film 4 attached to the s...
Embodiment 3
[0044] Embodiment 3 According to the following steps, the piezoelectric coefficient d 31 FEP composite film piezoelectret3.
[0045] Steps 1 to 6 in Example 1 were repeated.
[0046] 1. Using a pin-plate corona charging system to corona charge the FEP composite film 1 . The distance between the corona needle and the surface of the FEP composite film 1 is 4cm, the corona voltage is -20kV, the charging time is 5min, and the ambient temperature is 15 o c.
[0047] 2. Vacuum vapor-deposit aluminum electrodes with a thickness of 100 nm on both sides of the FEP composite film.
[0048] The FEP composite film piezoelectric electret 3 is obtained through the above steps.
[0049] A 100Hz sinusoidal force signal is used to excite the FEP composite film piezoelectric electret 3 to obtain d 31 is 50 pC / N.
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com