Hexamethylene diisocyanate (HDI) plate with symmetrically pressed structure and manufacturing method thereof

Abstract

The invention discloses a hexamethylene diisocyanate (HDI) plate with a symmetrically pressed structure and a manufacturing method thereof. The manufacturing method comprises the following steps of: A, pressing a second copper foil layer on the upper side of a core plate, and pressing a fifth copper foil layer on the lower side of the core plate; B, performing laser hole drilling on the second copper foil layer to form a second laser blind hole, and performing laser hole drilling on the fifth copper foil layer to form a fourth laser blind hole; C, pressing a first copper foil layer on the second copper foil layer, and pressing a sixth copper foil layer on the fifth copper foil layer; and D, performing laser hole drilling on the first copper foil layer to form a first laser blind hole and a third laser blind hole, performing laser hole drilling on the sixth copper foil layer to form a fifth laser blind hole and a sixth laser blind hole, wherein the third laser blind hole is stacked with the second laser blind hole, and the fifth laser blind hole is stacked with the fourth laser blind hole. Compared with the prior art, the HDI plate has the advantages that the pressed stacked structure is changed; asymmetric pressing is replaced by symmetric pressing; after pressing for the first time, one core plate replaces two core plates; the expansion and contraction of the HDI plate are easy to control during manufacturing; and furthermore, layer deflection is improved greatly, the manufacturing difficulty is reduced greatly, and the production period is shortened.

Description

Technical field: [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a symmetrical lamination structure HDI board and a production method. Background technique: [0002] HDI circuit board, also known as high-density interconnection board, is a circuit board with relatively high circuit distribution density using micro-blind buried hole technology, which can reduce the production cost of multi-layer PCB boards, increase circuit density, high reliability, and power Good performance and other advantages. [0003] At present, the production process of HDI circuit board is as follows: figure 1 As shown, taking a six-layer laser-drilled HDI board as an example, copper foil layers 101 and 102 are arranged on the upper and lower sides of the core board 107, and copper foil layers 105 and 106 are arranged on the upper and lower sides of the core board 111. 105 to make an inner layer circuit pattern, and perform inner layer e...

AI Technical Summary

Problems solved by technology

[0006] For this reason, the object of the present invention is to provide a kind of HDI plate of symmetrical lamination structure and its manufacturing method, to solve the problems of asymmetry of lamination structure in the production of existing HDI boards, which may easily lead to wear out, breakage of the plate, and expansion and contraction of the plate. It is difficult to control, and it is easy to cause the problem of layer deviation in the second pressing

Images