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Rigid-flex board and manufacturing method thereof

A technology of rigid-flex board and manufacturing method, which is applied in the structural connection of printed circuit, printed circuit parts, and assembling printed circuit with electrical components, etc. The effect of shrinking the extreme difference, avoiding layer deviation, and saving production costs

Active Publication Date: 2019-09-17
SHENZHEN KINWONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a rigid-flexible board and its manufacturing method, aiming to solve the problem that the expansion and contraction of the existing rigid-flexible board are difficult to control

Method used

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  • Rigid-flex board and manufacturing method thereof
  • Rigid-flex board and manufacturing method thereof
  • Rigid-flex board and manufacturing method thereof

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Embodiment Construction

[0026] The present invention provides a rigid-flex board and its manufacturing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of a method for manufacturing a rigid-flexible board of the present invention, as shown in the figure, which includes steps:

[0028] S1. Cut the flexible board and punch out the riveting holes, use the cover film to fit the two sides of the flexible board and pre-press, and then perform roughening treatment;

[0029] S2. Cutting the rigid plate, punching out the riveting hole and processing the blind groove;

[0030] S3. Stack the rigid board, prepreg, flexible board, prepreg, and rigid board ...

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Abstract

The invention discloses a rigid-flexible board and a production method thereof. The production method comprises the following steps: A, cutting a flexible board and punching to obtain riveting holes, laminating two sides of the flexible board by adopting cover films, prepressing and then carrying out roughening treatment; B, cutting a rigid board, punching to obtain riveting holes and carrying out blind groove processing; C, stacking the rigid board, a prepreg, the flexible board, the prepreg and the rigid board according to the sequence, and fixing and aligning at positions of the riveting holes by adopting rivets, and then placing into a laminating machine for laminating to obtain the rigid-flexible board. According to the rigid-flexible board and the production method thereof disclosed by the invention, the problem of expanding and collapsing of the rigid-flexible board in a production process is improved, the problem of great extreme deviation after laminating is solved, the reliability of the rigid-flexible board is improved, the misregitration phenomenon is avoided, the production efficiency is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a rigid-flex board and a manufacturing method thereof. Background technique [0002] Rigid-flex boards are made by laminating rigid boards and flexible boards through semi-cured adhesive sheets. Rigid-flex products have a complex structure and a wide variety, and the difficulty of making rigid-flex boards is well known in the industry. [0003] At present, the flexible board materials used in the electronic circuit industry are special. Most of the flexible board base materials are made of polyimide (PI) materials. One of its characteristics is that it changes greatly with temperature and humidity. Moreover, the expansion and contraction of each flexible board after the pre-lamination process of the same batch of flexible boards is inconsistent, resulting in a large extreme difference. Compared with the rigid board (epoxy resin) laminated together, the expansion and contra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14H05K3/36
Inventor 侯利娟马奕
Owner SHENZHEN KINWONG ELECTRONICS
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