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Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool

A sapphire crystal and resin technology, applied in metal processing equipment, manufacturing tools, grinding/polishing equipment, etc., can solve the problems of poor surface stability and short service life of abrasive tools

Inactive Publication Date: 2012-06-27
云南光电辅料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a resin abrasive tool for sapphire crystal processing and its preparation method, which solves the problems of short service life and poor surface stability of the abrasive tool when the resin abrasive tool processes sapphire crystal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 20 grams of 40 / 45 diamond powder, 30 grams of PF2802A phenolic resin powder, 0.5 grams of cubic phase β crystal silicon carbide whiskers with a particle size of 3 μm and an aspect ratio of 30, 40 grams of 300 mesh copper powder, and 1 gram of KH550 silicon coupling agent, Mix the materials for 1 hour to obtain the molding material; put the molding material and the Φ200×20T×5 substrate into the mold, press and mold the molding material on the substrate at 200°C and 3MPa, hold the temperature for 40 minutes for pre-curing, and demould to obtain Pre-cured resin abrasive tool; post-cure the pre-cured resin abrasive tool at 200°C for 10 hours to obtain a semi-finished resin abrasive tool; remove burrs and flash from the semi-finished resin abrasive tool with a silicon carbide grinding wheel to obtain Φ200×20T×5 sapphire Resin abrasives for crystal processing.

Embodiment 2

[0023] 25 grams of 50 / 60 diamond powder, 30 grams of EXP0019 phenolic resin powder, 1 gram of cubic phase β crystal silicon carbide whiskers with a particle size of 5 μm and an aspect ratio of 30, 40 grams of 300 mesh copper powder, and 1 gram of KH550 silicon coupling agent, Mix the materials for 1 hour to obtain the molding material; put the molding material and the Φ200×20T×5 substrate into the mold, press and mold the molding material on the substrate at 200°C and 3MPa, hold the temperature for 40 minutes for pre-curing, and demould to obtain Pre-cured resin abrasives; demoulding to obtain pre-cured resin abrasives; post-curing pre-cured resin abrasives at 200°C for 12 hours to obtain semi-finished resin abrasives; deburring semi-finished resin abrasives with silicon carbide grinding wheels And flash to get Φ200×20T×5 resin abrasive tool for sapphire crystal processing.

Embodiment 3

[0025] 15 grams of 40 / 45 diamond powder, 30 grams of PF2802A phenolic resin powder, 0.3 grams of cubic phase β-crystalline silicon carbide whiskers with a particle size of 3 μm and an aspect ratio of 30, 25 grams of 300-mesh copper powder, 20 grams of 300-mesh zinc oxide, and KH550 Mix 1 gram of silicon coupling agent for 1 hour to obtain molding material; put the molding material into the mold with a Φ200×20T×5 substrate, press and mold the molding material on the substrate at 200°C and 3MPa, and keep warm for 40 minutes Pre-cure and demould to obtain a pre-cured resin abrasive; continue to post-cure the pre-cured resin abrasive at 200°C for 10 hours to obtain a semi-finished resin abrasive; use a silicon carbide grinding wheel to remove burrs and flash A resin abrasive tool for Φ200×20T×5 sapphire crystal processing was obtained.

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Abstract

The invention discloses a resin-bonded grinding tool for processing sapphire crystals and a preparation method for the resin-bonded grinding tool. The resin-bonded grinding tool for processing the sapphire crystals is obtained by mixing, hot-pressing, post-curing and post-trimming forming materials and a matrix, wherein the forming materials include diamond abrasives, thermosetting resin powder, filling agents, silicon carbide whiskers and wetting agents. The silicon carbide whiskers with the Mohs hardness of 9.5 grades are added into the resin-bonded grinding tool, so that the grinding tool for grinding the sapphire crystals is high in efficiency and long in service life, and the surface smoothness of the sapphire crystals can be improved by means of the polishing function of the silicon carbide whiskers.

Description

technical field [0001] The invention relates to a resin abrasive tool and a preparation method thereof, in particular to a resin abrasive tool for sapphire crystal processing and a preparation method thereof. Background technique [0002] Sapphire crystal, as a crystal material integrating excellent optical properties, physical properties, mechanical properties and chemical properties, is widely used in LED lighting substrates, missile seeker domes, high-energy detection and high-power laser windows. [0003] Sapphire crystal is α-AL 2 o 3 Crystal, with a Mohs hardness of 9, is difficult to process. For example, when using metal-bonded diamond abrasive tools to process sapphire crystals, because the bonding agent has poor self-sharpening, the surface is easily blocked during processing, thereby straining the sapphire surface, and even producing deep scratches and fragments; using resin bonding agent When diamond abrasive tools process sapphire crystals, although self-shar...

Claims

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Application Information

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IPC IPC(8): B24D3/28B24D18/00
Inventor 和光杨俊宏
Owner 云南光电辅料有限公司
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