Semiconductor refrigerating device

Abstract

The invention belongs to the field of refrigerating equipment, and discloses a semiconductor refrigerating device. The device comprises a plurality of n-type semiconductor chips and p-type semiconductor chips which are connected end to end in series through electrodes and arranged at intervals and in parallel on the same plane; two sides of a plane formed by the n-type semiconductor chips and the p-type semiconductor chips connected in series are respectively jointed through a cold end component and a hot end component; a heat insulation material is encapsulated in a peripheral clearance formed by the cold end component, the hot end component, the n-type semiconductor chips and the p-type semiconductor chips; and a heat conducting insulation layer is respectively arranged on the jointed contact faces of the hot end component, the hot end component, the n-type semiconductor chips and the p-type semiconductor chips. By using the semiconductor material with thermoelectric energy conversion property, the device has refrigerating function during electrifying, actively and quickly absorbs a large amount of heat generated when a heating electronic component works, and provides an efficient heat dissipation channel between the heating electronic component and radiating fins.

Description

Technical field [0001] The present invention relates to a refrigeration device, in particular to a semiconductor refrigeration device that is well suited for cooling heat-generating electronic components such as integrated circuit chips, power-type light emitting diodes (LEDs) and the like. Background technique [0002] Integrated circuit chips, LEDs (light-emitting diodes), etc. are all electronic components that generate high heat. If heat is concentrated, improper heat dissipation treatment may cause these electronic components to fail to work properly or even burn out. [0003] At present, the heat dissipation measures for these electronic components are mainly heat sinks or heat sinks + fans. There are many shortcomings to using heat sinks alone. One is that it requires a large area and a large space, and the other is heat return; The way to add a fan to assist the heat dissipation, including many mechanical parts used to drive the fan, any failure of these parts may cause the...

AI Technical Summary

Problems solved by technology

However, the existing semiconductor refrigerators mainly use two pieces of Al 2 o 3 The so-called sandwich structure in which the ceramic sheet sandwiches the p-type semiconductor and the n-type semiconductor, due to Al 2 o 3 The thermal conductivity of ceramics is not high, generally 20-30W / mK, which is far lower than that of some metals. For example, copper can reach 360W / mK, which is Al 2 o 3 nearly 18 times that of ceramics, so the use of Al 2 o 3 The ceramic semiconductor cooling chip cannot conduct heat quickly, which undoubtedly greatly reduces its cooling effect and is not conducive to heat dissipation

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