Stereo lithography rapid prototyping photosensitive resin and preparation method thereof

A technology of photosensitive resin and stereolithography, which is applied in the direction of photomechanical equipment, optics, and pattern surface photolithography, etc., can solve the problems of working environment pollution, high irritation, and high volatility of diluents, and achieve photosensitivity Good, high-precision results

Inactive Publication Date: 2012-05-02
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these two applications, the diluents used in the preparation of photosensitive resins are trimethylolpropane triacrylate, tripropylene glycol diacrylate and 1,6-hexanediol diacrylate, etc., and these diluents are volatile Large and irritating, causing certain pollution to the working environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 900 g, bisphenol A type epoxy resin (E-51) 600 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400 grams, bisphenol A type epoxy acrylate (EA-612) 680 grams, ethylene glycol diglycidyl ether diacrylate 150 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams .

[0030] 2. Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 16.2 mJ / cm 2 , The test method is the method reported in "Zhao Yi. Experimental Research on Properties of Photosensitive Resin in Laser Rapid Prototyping [J]. Polymer Materials Science and Engineering, 2004, 20 (1): 184-186".

[0031] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with ...

Embodiment 2

[0033] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000g, bisphenol A type epoxy resin (E-51) 500g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 400g, bisphenol A type epoxy acrylate (EA-612) 530g, ethylene glycol diglycidyl ether diacrylate 300g, 2-hydroxy-2-methyl-1-phenyl-1-propanone 100g gram, 170 grams of triarylsulfonium hexafluoroantimonate.

[0034] 2. Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 15.4 mJ / cm 2 .

[0035] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=0.01, CF(11)=-0.02 were measured.

Embodiment 3

[0037] 1. Add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 1000g, bisphenol A type epoxy resin (E-51) 400g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 grams, bisphenol A type epoxy acrylate (EA-612) 430 grams, ethylene glycol diglycidyl ether diacrylate 400 grams, benzoin dimethyl ether 100 grams, triarylsulfonium hexafluoroantimonate 170 grams .

[0038] 2. Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 14.6 mJ / cm 2 .

[0039] 3. Utilize the SLA-3500 UV laser curing rapid prototyping equipment produced by 3D Systems to make some test pieces, and then post-cure these test pieces for 90 minutes in a UV box with a power of 500 milliwatts. Their warpage factors CF(6)=-0.01, CF(11)=0.02 were measured.

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PUM

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Abstract

The invention relates to a stereo lithography rapid prototyping photosensitive resin which is characterized by comprising the following raw materials according to the mass ratio: 5-30% of ethylene glycol diglycidyl ether diacrylate, 5-75% of epoxy resin, 5-55% of oxacyclobutane compound, 1-12% of cationic initiator, 5-50% of acrylic ester prepolymer and 1-10% of radical photopolymerization initiator. A preparation method of the stereo lithography rapid prototyping photosensitive resin comprises the steps of: mixing the raw material components according to the mass ratio; and then, heating andstirring, namely, stirring for 5-120 minutes at the temperature of 20-80 DEG C, and leading the obtained mixture to become transparent faint yellow uniform liquid. The photosensitive resin is low in irritation and less in volatile matter, and has good light sensitivity, wherein the critical exposure Ec is less than 16.5mJ / cm<2>; a molded part is high in accuracy and has the warpage factors CF (6) within the range of 0.01 to -0.01 and CF (11) within the range of 0.03 to -0.03; and parts with any complicated shapes and high accuracy can be directly manufactured, and the manufacturing cost is very low.

Description

technical field [0001] The invention belongs to the field of rapid prototyping manufacturing, and relates to rapid prototyping photosensitive resin and its preparation. Background technique [0002] Since 3D Systems in the United States first launched the stereolithography rapid prototyping machine in 1988, this machine can fully automatically produce complex three-dimensional objects that are difficult to produce by various processing methods, and has epoch-making significance in the field of processing technology. . It uses liquid photosensitive resin as raw material. Under the control of the computer, the ultraviolet laser scans the surface of the liquid photosensitive resin point by point according to the layered cross-section data of the part, so that the thin layer of resin in the scanned area undergoes photopolymerization and solidifies to form a part. A thin layer; after one layer is cured, the workbench is lowered, and a new layer of liquid resin is coated on the s...

Claims

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Application Information

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IPC IPC(8): G03F7/027
Inventor 黄笔武陈新平
Owner NANCHANG UNIV
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