Base plate packaging device and base plate packaging method

Abstract

The invention discloses a base plate packaging device. A base plate back cover is packaged on a coated base plate, and the edge of outer frame of display module of the base plate back cover is coated with an inner packaged powder layer and is covered on the coated base plate to form a base plate to be packaged. The base plate packaging device includes a working platform, a laser generation device and a positioning platform. The working platform is provided with a transverse beam; a supporting piece is connected between the transverse beam and the working platform; the positioning platform is slidingly disposed on the working platform; the laser generation device is slidingly mounted on the transverse beam, and the laser head of the laser generation device is over against the positioning platform; the part of the transverse beam close to the laser generation device is provided with a positioning lens corresponding to the positioning platform; the base plate to be packaged is positioned by the positioning platform through the positioning lens; the inner packaged powder layer on the positioned base plate to be packaged is scanned by the laser head to form an integrated packaged base plate, so that the base plate back cover can be packaged on the coated base plate under atmosphere to reduce production cost.

Description

technical field [0001] The present invention relates to the field of substrate packaging in organic light emitting diodes, in particular to a substrate packaging device and substrate packaging method for packaging the back cover of the substrate in organic light emitting diodes on a coated substrate. Background technique [0002] With the continuous development of the economy, the continuous improvement of science and technology and the increasing shortage of natural resources, companies are urged to increase investment in research and development in order to develop new energy-saving products, and OLED is one of many energy-saving products. [0003] OLED (English full name is Organic Light-Emitting Diode, Chinese full name is Organic Light-Emitting Diode) has been widely used on the display screen of digital products due to its thinness and power saving characteristics, and has great market potential. The application of OLED is focused on flat-panel displays, because OLED i...

AI Technical Summary

Problems solved by technology

[0004] However, in the process of packaging the coated substrate by the substrate back cover, a desiccant needs to be pasted on the coated substrate, and the desiccant is fixed on the coated substrate by means of ultraviolet light, and the substrate back cover needs to be adhered to the coated substrate with the help of epoxy resin. on the coated substrate of the desiccant, and it is necessary to prevent the atmosphere from being sealed in the space between the substrate back cover and the coated substrate. Therefore, the existing substrate back cover needs to be filled with an inert gas (such as nitrogen or argon, etc.) in a glove box, which increases the difficulty of packaging the coated substrate with the substrate back cover, and correspondingly increases the manufacturing cost

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