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LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof

A technology of LED modules and PCB boards, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuit components, electrical components, etc. Poor performance and other problems, to achieve the effect of high transmittance, low cost, and improve light extraction efficiency

Inactive Publication Date: 2012-03-14
HANGZHOU HPWINNER OPTO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned LED module has the following defects: because the heat dissipation of the LED chip needs to pass through many interlayers in the heat conduction channel, and the medium between the LED heat sink and the PCB board 102, and the medium between the PCB board 102 and the radiator 101 is air or silicone grease. Vias have low thermal conductivity, so thermal performance is poor
[0007] For general LED application lamps, after the light is emitted from the chip, it generally passes through: phosphor, packaging lens, air, light distribution lens, and then to the light transmission cover. The light passes through many media, and reflection loss occurs at each interface, so the total low optical transmittance
Therefore, there are disadvantages such as poor heat dissipation performance, low optical transmittance, complicated production process, and high cost.

Method used

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  • LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof
  • LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof
  • LED (Light Emitting Diode) module based on ceramic-based PCB (Printed Circuit Board) and manufacturing process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0107] like figure 2 As shown, an LED module includes: a heat sink 201 , a ceramic base PCB 202 , an LED chip 203 , an LED open circuit protector 204 , encapsulating colloid, sealing silica gel 206 , and a lens module 207 .

[0108] The LED open circuit protector 204 is connected in parallel with the LED chip 203, and its function is for open circuit protection and anti-static. The LED open circuit protector 204 of this embodiment adopts a Zener diode.

[0109] The ceramic-based PCB 202 can also be a high-thermal-conductivity ceramic-based PCB, which includes a ceramic substrate 301 and an electrical layer 303 .

[0110] like image 3 , Figure 4 As shown, the ceramic base PCB contains fired unpenetrated dimples, and a fired electrical layer 303 . The electrical layer 303 is the positive and negative electrodes and electrical connection lines sintered on the ceramic substrate 301 . The LED chip 203 is directly loaded on the base of the unpenetrated pit, and is welded to ...

Embodiment 2

[0131] The ceramic base PCB 202 of this embodiment is not provided with a pit for installing the LED chip 203 , but the LED chip 203 is directly covered on the ceramic substrate 301 of the ceramic base PCB 202 . The surface of the ceramic substrate 301 where the LED chip 203 is covered is a brightened smooth surface, and the brightened smooth surface may further have a coated mirror surface. The remainder of this embodiment is the same as in Embodiment 1.

[0132] A manufacturing process of an LED module based on a ceramic-based PCB board 202, the steps are as follows:

[0133] (1) sintering electrical layer 303 on ceramic base PCB board 202, described electrical layer 303 is positive and negative electrodes and electrical connecting circuit sintered on ceramic substrate 301;

[0134] (2) The position for installing the LED chip 203 on the ceramic-based PCB board 202 is polished into a reflective smooth surface through a mirror brightening process, or coated with silver on th...

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Abstract

The invention relates to an LED (Light Emitting Diode) module based on a ceramic-based PCB (Printed Circuit Board) and a manufacturing process thereof. The LED module comprises a heat radiator, the ceramic-based PCB, an LED chip, a package colloid, a sealing silicon rubber and a lens module, wherein the LED chip is coated by fluorescent powder, is loaded on the ceramic-based PCB and is welded to an electrode bonding pad of an electrical layer of the ceramic-based PCB through a lead; the ceramic-based PCB is attached to the heat radiator; the lens module is arranged above the LED chip; and a lens concave pit on the lens module is filled with the package colloid. The LED chip is directly welded on a circuit board, so that the heat of the LED chip is directly diffused to the circuit board with high conductivity and the heat radiator and the heat radiating effect is improved. The package colloid is only arranged between the lens module and the LED chip; media through which the light passes are fewer; in addition, the refractive index of the filled colloid is matched with that of the lens module, so that the light emitting rate of the LED module is improved.

Description

technical field [0001] The invention relates to the field of semiconductor application and packaging, more specifically, to an LED module based on a ceramic substrate PCB and a manufacturing process thereof. Background technique [0002] With the development of LED chip technology and packaging technology, more and more LED products are used in the field of lighting, especially high-power white LEDs. Due to the characteristics of high light efficiency, long life, energy saving and environmental protection, suitable dimming control, and no mercury and other pollutants, LEDs have become a new generation of lighting sources after traditional light sources such as incandescent lamps and fluorescent lamps. [0003] LED is an electroluminescent semiconductor device, in which about 30% of the electrical energy is converted into light, and the remaining electrical energy is converted into heat, and the temperature rise of LED caused by heat accumulation is the main cause of LED ligh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/13H01L33/48H01L33/64H01L33/58H05K1/02H05K1/18H01L33/00
CPCH01L2224/48091
Inventor 陈凯黄建明杨帆
Owner HANGZHOU HPWINNER OPTO CORP
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