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Preparation method of modified epoxy resin

An epoxy resin and modification technology, which is applied in the field of preparation of modified epoxy resin, can solve the problems of parameter drift, shrinkage reduction, and performance deterioration of electronic components, etc., and achieve good expansion and reduce volume shrinkage.

Inactive Publication Date: 2012-02-15
SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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  • Application Information

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Problems solved by technology

The internal stress of the epoxy resin potting compound used for stress-sensitive electronic components will cause the performance of electronic components to deteriorate, the parameters will drift, and it will also make the adhesive joints or resin and fiber interfaces susceptible to environmental factors such as oxygen and water. attack, causing premature environmental damage
In order to eliminate the defects caused by resin volume shrinkage, in the past, people have reduced the shrinkage rate by adding inorganic fillers, toughening agents, etc., but this can only reduce the internal stress caused by volume shrinkage to a certain extent, but cannot fundamentally solve the problem. question

Method used

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  • Preparation method of modified epoxy resin
  • Preparation method of modified epoxy resin

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Embodiment Construction

[0017] The present invention will be described in detail below with reference to the accompanying drawings.

[0018] The present invention first synthesizes the spiro ring orthocarbonate prepolymer:

[0019] ⑴ Weigh M and TDI according to the molar ratio of M (spiro ring monomer): TDI (toluene-2,4-diisocyanate) in the ratio of 2:1, 3:2, 4:3, and put M into a three-necked bottle , add chloroform to dissolve it (according to the monomer mass: chloroform mass ratio is 1:10), control the oil bath temperature to 35°C, and electromagnetically stir.

[0020] (2) Dissolve TDI with 10 ml of chloroform, add the mixture into the constant pressure dropping funnel, install the funnel on the three-necked bottle, and install anhydrous CaCl above the dropping funnel 2 drying tube.

[0021] (3) Add the mixed solution in the funnel dropwise into the reaction bottle, react for 24 hours, then pour the obtained substance into a watch glass, let it cool naturally, the solvent evaporates naturally...

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Abstract

A preparation method of a modified epoxy resin includes synthesis of spiro orthocarbonate performed polymer and a subsequent preparation of the modified epoxy resin. Prepared performed polymer with a synthesis molar ratio of 2:1, 3:2, 4:3 and epoxy resin are mixed in a beaker at room temperature, added and mixed well with a boron trifluoride ethylamine curing agent 3wt% of the resin; the beaker with the mixture in is mixed in an supersonic wave washer and placed in a vacuum baking oven for 2 h bubble removal. An expanding monomer performed polymer synthesized by the invention can effectively reduce volume contraction in the epoxy resin solidification process and has good expansion effect; besides a volumetric change rate in the epoxy resin solidification process decreases as a performed polymer content and a spiromonomer content in the performed polymer increase.

Description

technical field [0001] The invention relates to a preparation method of modified epoxy resin, in particular to a preparation method of thermosetting modified epoxy resin. Background technique [0002] Epoxy materials (composite materials, plastics and adhesives, etc.) will shrink due to crosslinking of the resin and temperature changes during the curing process and use. When shrinkage is uneven, internal stresses are created within the material. Internal stress can cause changes and warpage in the size and shape of the workpiece, resulting in cracks, deterioration of the performance of the material, and even damage to the material. The internal stress of the epoxy resin potting compound used for stress-sensitive electronic components will cause the performance of electronic components to deteriorate and the parameters to drift, and it will also make the adhesive joints or resin and fiber interfaces susceptible to environmental factors such as oxygen and water. attack, caus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/20C08G59/50
Inventor 宁志高王长松梁兵李安东刘大晨
Owner SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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