Flexible substrate

A flexible substrate, ductility technology, applied in dielectric properties, thermoplastic polymer dielectrics, transportation and packaging, etc., to achieve high reliability, reliable bonding, and high productivity

Inactive Publication Date: 2012-02-01
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The present invention is to solve the above-mentioned technical problems, and its object is to provide a flexible substrate with high productivity and high reliability, which is repeatedly deformed during lamination and crimping processes during manufacture or during use in the product stage. In any case, there will be no disconnection in the conductor layer (internal conductor pattern, etc.)

Method used

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Examples

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Embodiment 1

[0048] figure 1 Schematically represents the structure of a flexible substrate (flexible multilayer substrate) according to an embodiment of the present invention, figure 1 (a) is a front sectional view, figure 1 (b) is an enlarged cross-sectional view showing a main part in an enlarged manner.

[0049] Such as figure 1 As shown in (a) and (b), the flexible substrate (flexible multilayer substrate) 10 includes: a resin layer (a thermoplastic resin layer in this embodiment 1) 1 constituting a base material layer; 1 and a conductor layer (conductor pattern) 2 having a predetermined pattern; 3 is provided on the thermoplastic resin layer 1.

[0050] In this flexible multilayer substrate 10 , the thermoplastic resin layer 1 is formed of a thermoplastic resin having a melting point of 250° C. or higher, such as liquid crystal polymer (LCP) or polyether ether ketone (PEEK).

[0051] Also, the thermoplastic resin layer 1 can have desired flexibility by adjusting its thickness or...

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Abstract

Disclosed is a highly reliable flexible substrate which does not undergo the disconnection in a conductive layer during a lamination step in the production process or when used in a product that undergoes deformation repeatedly. Specifically disclosed is a flexible substrate (10) comprising a resin layer (1) and a conductive layer (2) laminated on each other, wherein the conductive layer (2) comprises a first conductive layer (21) which comprises a first metal and a second conductive layer (22) which comprises a second metal having higher ductibility than that of the first metal and which is so arranged as to be intercalated between the resin layer and the first conductive layer.

Description

technical field [0001] The present invention relates to a multilayer substrate, and specifically, to a flexible substrate that can be bent or bent. Background technique [0002] Flexible substrates that can be bent or bent have been widely used in electronic devices such as cameras, mobile phones, personal computers, printers, and hard disk drives in recent years because they are suitable for installation areas with limited space. With the miniaturization of electronic devices, flexible substrates are becoming more and more miniaturized, high-density, and multi-layered. [0003] As one of the above-mentioned flexible substrates, a flexible substrate (flexible printed circuit board) formed by laminating a polyimide film, which is a thermoplastic resin, and a copper foil (conductor layer) is known (refer to the description of Patent Document 1 [ 0014], etc.). [0004] As described above, since flexible substrates are suitable for installation in narrow spaces and can be repe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09
CPCH05K3/388H05K1/09H05K2201/0338H05K3/4069H05K3/244H05K2201/0394H05K3/384H05K1/028H05K2201/0129H05K2201/0141H05K3/4617Y10T428/12542Y10T428/24917
Inventor 千阪俊介
Owner MURATA MFG CO LTD
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